SCHEMBL600986

SCHEMBL600986

CC(C)(C)c1cccc(-c2c3ccccc3nc3ccccc23)c1

nearest known ligand 0.53

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
ABCG2 Q9UNQ0 3/20 0.53
ESR1 P03372 6/20 0.51
ESR2 Q92731 4/20 0.51
KIF11 P52732 1/20 0.49
RXRA P19793 1/20 0.44
RXRB P28702 1/20 0.44
TNKS O95271 1/20 0.42
TNKS2 Q9H2K2 1/20 0.42
ATM Q13315 1/20 0.42
TACR3 P29371 1/20 0.41
SMN1; SMN2 Q16637 2/20 0.40
TP53 P04637 1/20 0.40
TMEM97 Q5BJF2 1/20 0.39
SIGMAR1 Q99720 1/20 0.39
ELANE P08246 1/20 0.38
AKT1 P31749 1/20 0.38
AKT2 P31751 1/20 0.38
LMNA P02545 1/20 0.38
HPGD P15428 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29488281 1.00 ABCG2 (0.53) ABCG2ESR1ESR2KIF11RXRA
SCHEMBL29274260 0.86 ESR1 (0.50) ABCG2ESR1ESR2RXRARXRB
SCHEMBL30956247 0.86 ESR1 (0.50) ABCG2ESR1ESR2RXRARXRB
SCHEMBL28364734 0.85 ESR1 (0.58) ABCG2ESR1ESR2KIF11TNKS
SCHEMBL28015346 0.83 KIF11 (0.47) ABCG2ESR1ESR2KIF11RXRA
SCHEMBL29488291 0.81 TNKS (0.56) ABCG2ESR1ESR2KIF11TNKS
SCHEMBL601648 0.81 TNKS (0.56) ABCG2ESR1ESR2KIF11TNKS
SCHEMBL15125383 0.78 ABCG2 (0.59) ABCG2KIF11RXRARXRBSMN1; SMN2
SCHEMBL28847988 0.78 ABCG2 (0.46) ABCG2ESR1ESR2KIF11RXRA
SCHEMBL25877823 0.78 ABCG2 (0.49) ABCG2KIF11RXRARXRBTNKS

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 44 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110357989-B Tertiary amine photosensitizer, preparation method thereof, photosensitive resin composition containing tertiary amine photosensitizer and application of photosensitive resin composition 常州强力电子新材料股份有限公司 2022-04-22 CN claimed
CN-108241259-B Resist composition with good hole masking function and capable of directly depicting, exposing and imaging 杭州福斯特电子材料有限公司 2021-08-10 CN claimed
US-5346805-A Initiator comprising an onium compound and an acridine derivative; printing plate, resist, photomask FUJI PHOTO FILM CO., LTD. (JP) 1994-09-13 US claimed
US-4587200-A Photopolymerizable composition comprising an acridine and a heterocyclic thiol compound as a photopolymerization initiator and a photographic process using said photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 1986-05-06 US claimed
US-12353130-B2 Photosensitive resin composition and photosensitive resin multilayer body ASAHI KASEI KABUSHIKI KAISHA (JP) 2025-07-08 US disclosed
US-20240408595-A1 STRUCTURE COMPRISING MICROCHANNEL, PRODUCTION METHOD FOR SAID STRUCTURE, AND MICROCHANNEL DEVICE ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-12-12 US disclosed
US-12032286-B2 Method for producing multi-layered type microchannel device using photosensitive resin laminate ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-07-09 US disclosed
CN-113156764-B Photosensitive resin composition and resist laminate 杭州福斯特电子材料有限公司 2024-04-26 CN disclosed
US-20240059803-A1 PHOTOSENSITIVE RESIN MULTILAYER BODY AND METHOD FOR PRODUCING SAME ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-02-22 US disclosed
US-20230375930-A1 PHOTOSENSITIVE RESIN MULTILAYER BODY ASAHI KASEI KABUSHIKI KAISHA (JP) 2023-11-23 US disclosed
WO-2023068276-A1 STRUCTURE COMPRISING MICROCHANNEL, PRODUCTION METHOD FOR SAID STRUCTURE, AND MICROCHANNEL DEVICE 旭化成株式会社 2023-04-27 WO disclosed
US-20230053900-A1 METHOD FOR PRODUCING MULTI-LAYERED TYPE MICROCHANNEL DEVICE USING PHOTOSENITIVE RESIN LAMINATE ASAHI KASEI KABUSHIKI KAISHA (JP) 2023-02-23 US disclosed
US-20120040290-A1 PHOTOSENSITIVE RESIN COMPOSITION, AND PHOTOSENSITIVE ELEMENT, RESIST PATTERN FORMATION METHOD AND PRINTED CIRCUIT BOARD PRODUCTION METHOD EACH UTILIZING SAME HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-02-16 US disclosed
CN-102144189-A Photosensitive resin composition, photosensitive resin laminate, method for forming resist pattern, conductive pattern, printed wiring board, lead frame, base, and method for manufacturing semiconductor package ASAHI KASEI E MATERIALS CORP 2011-08-03 CN disclosed
US-20100159691-A1 PHOTOSENSITIVE RESIN COMPOSITION AND LAMINATE ASAHI KASEI EMD CORPORATION (JP) 2010-06-24 US disclosed
CN-1945429-B Photosensitive resin composition and photosensitive resin laminate using the same ASAHI KASEI DENSHI K K 2010-06-09 CN disclosed
CN-101438208-A Photosensitive resin composition ASAHI KASEI EMD CORP (JP) 2009-05-20 CN disclosed
CN-1945429-A Photosensitive resin composition and photosensitive resin laminate using the same ASAHI KASEI DENSHI K K (JP) 2007-04-11 CN disclosed
US-5346805-A Initiator comprising an onium compound and an acridine derivative; printing plate, resist, photomask FUJI PHOTO FILM CO., LTD. (JP) 1994-09-13 US disclosed
US-4587200-A Photopolymerizable composition comprising an acridine and a heterocyclic thiol compound as a photopolymerization initiator and a photographic process using said photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 1986-05-06 US disclosed