SCHEMBL29488304

SCHEMBL29488304

COc1cccc2c1-c1ccccc1C2(c1ccc(N)cc1)c1ccc(N)cc1

nearest known ligand 0.60

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 5/20 0.60
MEN1 O00255 5/20 0.60
KMT2A Q03164 5/20 0.60
SMN1; SMN2 Q16637 3/20 0.60
KDM4E B2RXH2 2/20 0.60
LMNA P02545 1/20 0.60
OPRK1 P41145 1/20 0.60
PDK2 Q15119 2/20 0.50
ALDH1A1 P00352 5/20 0.39
MAPK1 P28482 2/20 0.39
L3MBTL1 Q9Y468 1/20 0.39
POLB P06746 2/20 0.38
RAB9A P51151 2/20 0.38
CA1 P00915 1/20 0.38
CA2 P00918 1/20 0.38
CA7 P43166 1/20 0.38
CA9 Q16790 1/20 0.38
FGB P02675 1/20 0.38
THRB P10828 1/20 0.38
ADORA2A P29274 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30749099 0.82 PDK2 (0.59) MAPTMEN1KMT2ASMN1; SMN2KDM4E
SCHEMBL4660239 0.81 MEN1 (0.68) MAPTMEN1KMT2ASMN1; SMN2KDM4E
SCHEMBL29581020 0.77 MEN1 (0.66) MAPTMEN1KMT2ASMN1; SMN2KDM4E
SCHEMBL7055911 0.77 MEN1 (0.66) MAPTMEN1KMT2ASMN1; SMN2KDM4E
SCHEMBL5968745 0.77 PDK2 (0.56) MAPTMEN1KMT2ASMN1; SMN2KDM4E
SCHEMBL5968770 0.77 KDM4E (0.53) MAPTMEN1KMT2ASMN1; SMN2KDM4E
SCHEMBL29392989 0.77 MAPT (1.00) MAPTMEN1KMT2ASMN1; SMN2KDM4E
SCHEMBL29426418 0.77 MAPT (1.00) MAPTMEN1KMT2ASMN1; SMN2KDM4E
SCHEMBL105428 0.77 MAPT (1.00) MAPTMEN1KMT2ASMN1; SMN2KDM4E
SCHEMBL29488299 0.77 MEN1 (0.60) MAPTMEN1KMT2ASMN1; SMN2KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110734736-B Adhesive for temporary bonding, adhesive layer, wafer processed body, and method for manufacturing semiconductor device using same 东丽株式会社 2022-04-19 CN disclosed