SCHEMBL29488299

SCHEMBL29488299

CCc1cccc2c1-c1ccccc1C2(c1ccc(N)cc1)c1ccc(N)cc1

nearest known ligand 0.60

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 2/20 0.60
KMT2A Q03164 2/20 0.60
KDM4E B2RXH2 1/20 0.60
LMNA P02545 1/20 0.60
MAPT P10636 1/20 0.60
OPRK1 P41145 1/20 0.60
SMN1; SMN2 Q16637 1/20 0.60
PDK2 Q15119 8/20 0.50
POLB P06746 2/20 0.41
CYP2D6 P10635 1/20 0.39
HTR7 P34969 1/20 0.38
HTR2B P41595 1/20 0.38
ESR1 P03372 1/20 0.35
ESR2 Q92731 1/20 0.35
CYP2C9 P11712 1/20 0.33
HPGD P15428 1/20 0.33
CYP2C19 P33261 1/20 0.33
MDM2 Q00987 1/20 0.32
GABRA1 P14867 2/20 0.31
GABRB2 P47870 2/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4657916 0.88 MEN1 (0.60) MEN1KMT2AKDM4ELMNAMAPT
SCHEMBL4657918 0.85 MEN1 (0.60) MEN1KMT2AKDM4ELMNAMAPT
SCHEMBL4658905 0.85 MEN1 (0.60) MEN1KMT2AKDM4ELMNAMAPT
SCHEMBL4660239 0.81 MEN1 (0.68) MEN1KMT2AKDM4ELMNAMAPT
SCHEMBL7055911 0.77 MEN1 (0.66) MEN1KMT2AKDM4ELMNAMAPT
SCHEMBL29581020 0.77 MEN1 (0.66) MEN1KMT2AKDM4ELMNAMAPT
SCHEMBL29392989 0.77 MAPT (1.00) MEN1KMT2AKDM4ELMNAMAPT
SCHEMBL105428 0.77 MAPT (1.00) MEN1KMT2AKDM4ELMNAMAPT
SCHEMBL29426418 0.77 MAPT (1.00) MEN1KMT2AKDM4ELMNAMAPT
SCHEMBL29488304 0.77 MAPT (0.60) MEN1KMT2AKDM4ELMNAMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110734736-B Adhesive for temporary bonding, adhesive layer, wafer processed body, and method for manufacturing semiconductor device using same 东丽株式会社 2022-04-19 CN disclosed