Predicted protein targets (top 18)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | NT5E | P21589 | 1/20 | 0.43 |
| ▸ | CNR1 | P21554 | 2/20 | 0.42 |
| ▸ | GPR55 | Q9Y2T6 | 2/20 | 0.42 |
| ▸ | PKM | P14618 | 2/20 | 0.42 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.41 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.41 |
| ▸ | MAPT | P10636 | 5/20 | 0.40 |
| ▸ | LMNA | P02545 | 3/20 | 0.40 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.40 |
| ▸ | HCRTR1 | O43613 | 1/20 | 0.40 |
| ▸ | USP2 | O75604 | 1/20 | 0.40 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.40 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.39 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.38 |
| ▸ | HTT | P42858 | 2/20 | 0.38 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.38 |
| ▸ | ADAMTS5 | Q9UNA0 | 1/20 | 0.37 |
| ▸ | RAD52 | P43351 | 1/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL14634509 | 1.00 | NT5E (0.43) | NT5ECNR1GPR55PKMCYP3A4 | |
| SCHEMBL16155483 | 0.83 | ADAMTS5 (0.51) | CNR1GPR55PKMMAPTLMNA | |
| SCHEMBL30468730 | 0.82 | NT5E (0.48) | NT5ECNR1GPR55PKMCYP3A4 | |
| SCHEMBL11929623 | 0.78 | MAPT (0.56) | CNR1GPR55PKMCYP3A4CYP2C19 | |
| SCHEMBL25908358 | 0.77 | CNR1 (0.56) | CNR1GPR55PKMMAPTLMNA | |
| SCHEMBL11714394 | 0.77 | CNR1 (0.48) | NT5ECNR1GPR55PKMCYP3A4 | |
| SCHEMBL29394877 | 0.77 | GPR55 (0.67) | NT5ECNR1GPR55PKMCYP3A4 | |
| SCHEMBL492340 | 0.77 | GPR55 (0.67) | NT5ECNR1GPR55PKMCYP3A4 | |
| SCHEMBL29083889 | 0.75 | MAPT (0.58) | NT5ECNR1GPR55PKMMAPT | |
| SCHEMBL14999582 | 0.74 | CNR1 (0.49) | CNR1GPR55PKMCYP3A4CYP2C19 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4610285-A1 | RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN COMPOSITE SHEET, AND PRINTED WIRING BOARD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2025-09-03 | — | — | EP | disclosed |
| CN-119866352-A | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 日本化药株式会社 | 2025-04-22 | — | — | CN | disclosed |
| CN-115003716-B | Resin composition, resin sheet, prepreg, and printed wiring board | 三菱瓦斯化学株式会社 | 2025-04-11 | — | — | CN | disclosed |
| CN-117529509-B | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2025-01-10 | — | — | CN | disclosed |
| CN-117355545-B | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2024-10-18 | — | — | CN | disclosed |
| CN-114787120-B | Compound and method for producing same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2024-08-09 | — | — | CN | disclosed |
| CN-115175951-B | Resin composition, cured product, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board | 三菱瓦斯化学株式会社 | 2024-07-12 | — | — | CN | disclosed |
| CN-118043384-A | Prepreg, laminate and printed circuit board | 三菱瓦斯化学株式会社 | 2024-05-14 | — | — | CN | disclosed |
| CN-117529509-A | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2024-02-06 | — | — | CN | disclosed |
| CN-117500851-A | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2024-02-02 | — | — | CN | disclosed |
| CN-114787276-A | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2022-07-22 | — | — | CN | disclosed |
| CN-113242996-B | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2022-07-12 | — | — | CN | disclosed |
| CN-110198968-B | Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board | 三菱瓦斯化学株式会社 | 2022-06-21 | — | — | CN | disclosed |
| WO-2022124130-A1 | COPPER-CLAD LAMINATED BOARD AND PRINTED WIRING BOARD | 三菱瓦斯化学株式会社 | 2022-06-16 | — | — | WO | disclosed |
| WO-2022124129-A1 | RESIN COMPOSITION, PREPREG, RESIN SHEET, METAL FOIL-CLAD LAYERED BOARD, AND PRINTED WIRING BOARD | 三菱瓦斯化学株式会社 | 2022-06-16 | — | — | WO | disclosed |
| CN-110869409-B | Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board | 三菱瓦斯化学株式会社 | 2022-05-31 | — | — | CN | disclosed |
| CN-110997755-B | Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board | 三菱瓦斯化学株式会社 | 2022-05-03 | — | — | CN | disclosed |
| CN-109415491-B | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2022-05-03 | — | — | CN | disclosed |
| CN-110869410-B | Resin composition for printed wiring board, prepreg, resin sheet, laminate, metal foil-clad laminate, printed wiring board, and multilayer printed wiring board | 三菱瓦斯化学株式会社 | 2022-04-26 | — | — | CN | disclosed |
| CN-109415489-B | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2022-03-04 | — | — | CN | disclosed |