SCHEMBL2951845

SCHEMBL2951845

CCCCCc1nc2cc(Cl)c(Cl)cc2[nH]1

nearest known ligand 0.68

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
GAA P10253 1/20 0.68
HTT P42858 1/20 0.68
PRKAG1 P54619 1/20 0.57
PRKAA2 P54646 1/20 0.57
PRKAA1 Q13131 1/20 0.57
PRKAB1 Q9Y478 1/20 0.57
CACNA1G O43497 2/20 0.51
CACNA1H O95180 1/20 0.51
PDE10A Q9Y233 1/20 0.50
KMT2A Q03164 2/20 0.47
MAPT P10636 2/20 0.46
PKM P14618 2/20 0.46
KDM4E B2RXH2 1/20 0.46
MEN1 O00255 1/20 0.46
TDP1 Q9NUW8 1/20 0.46
L3MBTL1 Q9Y468 1/20 0.46
GPR84 Q9NQS5 1/20 0.45
POLB P06746 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9720968 0.98 GAA (0.66) GAAHTTPRKAG1PRKAA2PRKAA1
SCHEMBL6757262 0.98 GAA (0.66) GAAHTTPRKAG1PRKAA2PRKAA1
SCHEMBL7559296 0.95 GAA (0.70) GAAHTTPRKAG1PRKAA2PRKAA1
SCHEMBL8637242 0.88 GAA (0.74) GAAHTTPRKAG1PRKAA2PRKAA1
SCHEMBL9288400 0.84 PRKAG1 (0.61) GAAHTTPRKAG1PRKAA2PRKAA1
SCHEMBL13804897 0.84 GAA (0.58) GAAHTTPRKAG1PRKAA2PRKAA1
SCHEMBL9887037 0.83 GAA (0.58) GAAHTTPRKAG1PRKAA2PRKAA1
SCHEMBL11134687 0.82 GAA (0.47) GAAHTTPRKAG1PRKAA2PRKAA1
SCHEMBL29749431 0.82 KMT2A (0.60) PDE10AKMT2AMAPTPKMKDM4E
SCHEMBL10336406 0.81 TDP1 (0.60) KMT2AMAPTPKMKDM4EMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5173130-A Immersing copper or alloy to be soldered in an aqueous solution containing a 2-alkylbenzimidazole and an organic acid to form a corrosion and heat resistant protective coating SHIKOKU CHEMICALS CORPORATION (JP) 1992-12-22 US claimed
US-20250215572-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY SHIKOKU CHEMICALS CORPORATION (JP) 2025-07-03 US disclosed
EP-4506488-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY Shikoku Chemicals Corporation (JP) 2025-02-12 EP disclosed
CN-118922584-A Surface treating agent for copper or copper alloy 四国化成工业株式会社 2024-11-08 CN disclosed
WO-2023190263-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY 四国化成工業株式会社 2023-10-05 WO disclosed
EP-3188577-B1 METHOD FOR FORMING ORGANIC COATING ON COPPER SURFACE ROHM & HAAS ELECT MAT (US) 2019-01-30 EP disclosed
EP-3188577-A1 METHOD FOR FORMING ORGANIC COATING ON COPPER SURFACE Rohm and Haas Electronic Materials LLC (US) 2017-07-05 EP disclosed
US-20170183783-A1 METHOD FOR FORMING ORGANIC COATING ON COPPER SURFACE ROHM & HAAS ELECT MAT (US) 2017-06-29 US disclosed
EP-1886759-B1 WATER-SOLUBLE PREFLUX AND USE THEREOF SHIKOKU CHEM (JP) 2016-10-05 EP disclosed
US-7754105-B2 Water-soluble preflux and usage of the same SHIKOKU CHEMICALS CORPORATION (JP) 2010-07-13 US disclosed
US-20080318070-A1 Water-Soluble Preflux and Usage of the Same SHIKOKU CHEMICALS CORPORATION (JP) 2008-12-25 US disclosed
EP-1886759-A1 WATER-SOLUBLE PREFLUX AND USE THEREOF SHIKOKU CHEMICALS CORPORATION (JP) 2008-02-13 EP disclosed
US-20020067486-A1 Solderability assessment AMERICAN COMPETITIVENESS INSTITUTE 2002-06-06 US disclosed
US-5960251-A Organic-metallic composite coating for copper surface protection INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 1999-09-28 US disclosed
WO-1997039610-A1 ORGANIC-METALLIC COMPOSITE COATING FOR COPPER SURFACE PROTECTION INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 1997-10-23 WO disclosed
US-5173130-A Immersing copper or alloy to be soldered in an aqueous solution containing a 2-alkylbenzimidazole and an organic acid to form a corrosion and heat resistant protective coating SHIKOKU CHEMICALS CORPORATION (JP) 1992-12-22 US disclosed
US-5166042-A Multilayer color photographic member FUJI PHOTO FILM CO., LTD. (JP) 1992-11-24 US disclosed
EP-0428383-A1 Process for surface treatment of copper and copper alloy SHIKOKU CHEMICALS CORPORATION (JP) 1991-05-22 EP disclosed
EP-0112552-A2 Use of pyrylium or thiapyrylium compounds as biological stains EASTMAN KODAK COMPANY (a New Jersey corporation) (US) 1984-07-04 EP disclosed
EP-0047470-A1 Method for immunochemical measurement FUJI PHOTO FILM CO., LTD. (JP) 1982-03-17 EP disclosed