⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL13910046 | 0.78 | — | — | |
| SCHEMBL649043 | 0.76 | — | — | |
| SCHEMBL10525141 | 0.72 | — | — | |
| SCHEMBL512554 | 0.67 | — | — | |
| Vinyl Ether SCHEMBL28547178 | 0.67 | — | — | |
| SCHEMBL162909 | 0.67 | — | — | |
| SCHEMBL1764054 | 0.66 | — | — | |
| SCHEMBL392003 | 0.66 | — | — | |
| SCHEMBL29076010 | 0.64 | — | — | |
| SCHEMBL160172 | 0.62 | THRB (0.33) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11958971-B2 | Photocurable composition, method for producing concave-convex structure, method for forming fine concave-convex pattern, and concave-convex structure | MITSUI CHEMICALS, INC. (JP) | 2024-04-16 | — | — | US | disclosed |
| US-11474429-B2 | Method of producing substrate with fine uneven pattern, resin composition, and laminate | MITSUI CHEMICALS, INC. (JP) | 2022-10-18 | — | — | US | disclosed |
| EP-3998298-A1 | PHOTOCURABLE COMPOSITION, PRODUCTION METHOD FOR UNEVEN STRUCTURAL BODY, METHOD FOR FORMING MINUTE UNEVEN PATTERN, AND UNEVEN STRUCTURAL BODY | Mitsui Chemicals, Inc. (JP) | 2022-05-18 | — | — | EP | disclosed |
| US-20220135787-A1 | PHOTOCURABLE COMPOSITION, METHOD FOR PRODUCING CONCAVE-CONVEX STRUCTURE, METHOD FOR FORMING FINE CONCAVE-CONVEX PATTERN, AND CONCAVE-CONVEX STRUCTURE | MITSUI CHEMICALS, INC. (JP) | 2022-05-05 | — | — | US | disclosed |