SCHEMBL296133

SCHEMBL296133

C=C(C)COCCC[SiH](OCC)OCC

nearest known ligand 0.32

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
CES2 O00748 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3158157 0.91 CES2 (0.30) CES2
SCHEMBL7718184 0.84 CES2 (0.32) CES2
SCHEMBL297600 0.81 CES2 (0.31) CES2
SCHEMBL2468774 0.78 CES2 (0.33) CES2
SCHEMBL3903654 0.78 ALDH1A1 (0.36)
SCHEMBL7629280 0.76
SCHEMBL3338920 0.76
SCHEMBL962974 0.76 CES2 (0.33) CES2
SCHEMBL871697 0.75 CES2 (0.44) CES2
SCHEMBL7256155 0.75 CES2 (0.39) CES2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 79 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117209673-B Flame-retardant low-temperature toughening synergistic anti-dripping agent and preparation method thereof 铨盛聚碳科技股份有限公司 2024-04-26 CN claimed
CN-117209673-A Flame-retardant low-temperature toughening synergistic anti-dripping agent and preparation method thereof 铨盛聚碳科技股份有限公司 2023-12-12 CN claimed
CN-113412320-A Modified epoxy acrylic resin conductive adhesive and preparation method and application thereof 深圳市首骋新材料科技有限公司 2021-09-17 CN claimed
CN-113412312-A Acrylic acid conductive adhesive and preparation method and application thereof 深圳市首骋新材料科技有限公司 2021-09-17 CN claimed
EP-1582936-B1 Method for evaluating colouring agent, colouring agent and toner for electrostatic latent image development BROTHER IND LTD (JP) 2012-03-14 EP claimed
EP-1582936-A1 Method for evaluating colouring agent, colouring agent and toner for electrostatic latent image development BROTHER KOGYO KABUSHIKI KAISHA (JP) 2005-10-05 EP claimed
US-20050214667-A1 Method for evaluating coloring agent, coloring agent, and toner for electrostatic latent image development BROTHER KOGYO KABUSHIKI KAISHA (JP) 2005-09-29 US claimed
EP-4737506-A1 CURED FILM AND ORGANIC EL DISPLAY DEVICE Toray Industries, Inc. (JP) 2026-05-06 EP disclosed
US-20260109849-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-23 US disclosed
US-20250353781-A1 GLASS CLOTH AND METHOD OF MANUFACTURE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-11-20 US disclosed
WO-2025121026-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, RESIN FILM, AND SEMICONDUCTOR DEVICE 旭化成株式会社 2025-06-12 WO disclosed
US-12264236-B2 Rubber composition for sealing material and sealing material using the same VALQUA, LTD. (JP) 2025-04-01 US disclosed
WO-2025009354-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE 旭化成株式会社 2025-01-09 WO disclosed
EP-1582936-A1 Method for evaluating colouring agent, colouring agent and toner for electrostatic latent image development BROTHER KOGYO KABUSHIKI KAISHA (JP) 2005-10-05 EP disclosed
US-20050214667-A1 Method for evaluating coloring agent, coloring agent, and toner for electrostatic latent image development BROTHER KOGYO KABUSHIKI KAISHA (JP) 2005-09-29 US disclosed
US-20050064125-A1 Pressure sensitive adhesive film for overlamination LINTEC CORPORATION (JP) 2005-03-24 US disclosed
EP-1460116-A1 PRESSURE SENSITIVE ADHESIVE FILM FOR OVERLAMINATION LINTEC Corporation (JP) 2004-09-22 EP disclosed
US-6407157-B2 A GLASS FIBER REINFORCED POLYAMIDE RESIN CONSISTS OF A POLYAMIDE RESIN, GLASS FIBERS, A HIGHER FATTY ACID AMIDE AND A HIGHER FATTY ACID METAL SALT ASAHI KASEI KABUSHIKI KAISHA (JP) 2002-06-18 US disclosed
US-20010047050-A1 Glass fiber reinforced polyamide resin composition ASAHI KASEI KABUSHIKI KAISHA (JP) 2001-11-29 US disclosed
US-5190828-A Low-gloss polyacetal resin compositions and molded articles POLYPLASTICS CO., LTD. (JP) 1993-03-02 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260109849-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE ASH2L, DOT1L, ASH1L CES2 344/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.