SCHEMBL29645018

SCHEMBL29645018

O=C(c1ccc(OCCCOc2ccc(C(=NOS(=O)(=O)C(F)(F)F)C(F)(F)F)cc2)cc1)C(F)(F)F

nearest known ligand 0.43

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
CA12 O43570 2/20 0.43
CA1 P00915 2/20 0.43
CA2 P00918 2/20 0.43
CA9 Q16790 2/20 0.43
MLYCD O95822 2/20 0.41
PLA2G4B P0C869 1/20 0.38
HDAC1 Q13547 5/20 0.37
HDAC2 Q92769 5/20 0.37
CES1 P23141 1/20 0.37
HDAC3 O15379 2/20 0.37
HDAC4 P56524 2/20 0.37
HDAC7 Q8WUI4 2/20 0.37
HDAC10 Q969S8 2/20 0.37
HDAC11 Q96DB2 2/20 0.37
HDAC8 Q9BY41 2/20 0.37
HDAC6 Q9UBN7 2/20 0.37
HDAC9 Q9UKV0 2/20 0.37
HDAC5 Q9UQL6 2/20 0.37
L3MBTL1 Q9Y468 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL546602 0.94 CA12 (0.44) CA12CA1CA2CA9PLA2G4B
SCHEMBL546603 0.94 CA12 (0.44) CA12CA1CA2CA9PLA2G4B
SCHEMBL2610224 0.94 CA12 (0.44) CA12CA1CA2CA9PLA2G4B
SCHEMBL17762976 0.88 CA12 (0.40) CA12CA1CA2CA9PLA2G4B
SCHEMBL15299165 0.85 CA12 (0.39) CA12CA1CA2CA9PLA2G4B
Trifluoromethanesulfonic Acid SCHEMBL1309609 0.85 CA12 (0.39) CA12CA1CA2CA9PLA2G4B
SCHEMBL29645014 0.83 PLA2G4B (0.40) CA12CA1CA2CA9MLYCD
SCHEMBL963742 0.82 PLA2G4B (0.42) MLYCDPLA2G4BL3MBTL1
SCHEMBL2607803 0.82 FURIN (0.40) CA12CA1CA2CA9PLA2G4B
SCHEMBL963741 0.82 PLA2G4B (0.42) MLYCDPLA2G4BL3MBTL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115885217-A Negative resist film laminate and pattern forming method 信越化学工业株式会社 2023-03-31 CN disclosed
CN-114600045-A Photosensitive resin composition, photosensitive dry film and pattern forming method 信越化学工业株式会社 2022-06-07 CN disclosed