SCHEMBL29690459

SCHEMBL29690459

C=CC(OCCCOCCCC)c1ccccc1

nearest known ligand 0.38

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.38
TSHR P16473 2/20 0.38
RARB P10826 2/20 0.38
HPGD P15428 1/20 0.38
CASR P41180 1/20 0.37
LTA4H P09960 2/20 0.37
RECQL P46063 1/20 0.35
PLA2G4B P0C869 1/20 0.35
PTGS2 P35354 1/20 0.35
RARA P10276 1/20 0.33
PLA2G4A P47712 1/20 0.33
NPC1 O15118 1/20 0.33
LMNA P02545 1/20 0.33
RAB9A P51151 1/20 0.33
SMN1; SMN2 Q16637 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6540266 0.94 LTA4H (0.41) TSHRCASRLTA4HPLA2G4ANPC1
SCHEMBL27823090 0.89 LTA4H (0.41) TSHRCASRLTA4HPLA2G4BNPC1
SCHEMBL28035385 0.88 NPC1 (0.42) ALDH1A1TSHRRARBCASRLTA4H
SCHEMBL6541581 0.88 NPC1 (0.42) ALDH1A1TSHRRARBCASRLTA4H
SCHEMBL28034887 0.88 NPC1 (0.42) ALDH1A1TSHRRARBCASRLTA4H
SCHEMBL6541323 0.88 NPC1 (0.42) ALDH1A1TSHRRARBCASRLTA4H
SCHEMBL6678195 0.88 NPC1 (0.42) ALDH1A1TSHRRARBCASRLTA4H
SCHEMBL28035407 0.88 NPC1 (0.42) ALDH1A1TSHRRARBCASRLTA4H
SCHEMBL28034845 0.88 NPC1 (0.42) ALDH1A1TSHRRARBCASRLTA4H
SCHEMBL28034827 0.88 NPC1 (0.42) ALDH1A1TSHRRARBCASRLTA4H

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250154361-A1 RECESS FILLING MATERIAL KIT, CURED PRODUCT THEREOF, AND RECESS FILLING METHOD RESONAC CORPORATION (JP) 2025-05-15 US disclosed
CN-114829432-B Radical polymerizable resin composition and cured product thereof 株式会社力森诺科 2024-09-17 CN disclosed
CN-114685745-B Method for producing urethane (meth) acrylate and urethane (meth) acrylate resin 株式会社力森诺科 2024-09-17 CN disclosed
CN-114846032-B Radical polymerizable resin composition and cured product thereof 株式会社力森诺科 2024-06-18 CN disclosed
EP-4328206-A1 RECESS FILLING MATERIAL KIT, CURED PRODUCT OF SAME, AND RECESS FILLING METHOD Resonac Corporation (JP) 2024-02-28 EP disclosed
CN-110799558-B Radical polymerizable resin composition and structural repair material 株式会社力森诺科 2024-02-20 CN disclosed
CN-117136175-A Recess filling material kit, cured product thereof, and recess filling method 株式会社力森诺科 2023-11-28 CN disclosed
CN-116917249-A Recess filling material kit, cured product thereof, and recess filling method 株式会社力森诺科 2023-10-20 CN disclosed
CN-114846032-A Radical polymerizable resin composition and cured product thereof 昭和电工株式会社 2022-08-02 CN disclosed
CN-114829432-A Radical polymerizable resin composition and cured product thereof 昭和电工株式会社 2022-07-29 CN disclosed
CN-114685745-A Urethane (meth) acrylate and method for producing urethane (meth) acrylate resin 昭和电工株式会社 2022-07-01 CN disclosed
CN-109071777-B Composition for carbon fiber-reinforced resin, carbon fiber-reinforced resin composition, and cured product 昭和电工株式会社 2022-06-10 CN disclosed