SCHEMBL6540266

SCHEMBL6540266

C=CC(OCCCC)c1ccccc1

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LTA4H P09960 2/20 0.41
CASR P41180 1/20 0.39
CYP1A2 P05177 2/20 0.36
CYP2C9 P11712 1/20 0.36
CYP2C19 P33261 1/20 0.36
TSHR P16473 3/20 0.36
HTT P42858 2/20 0.36
TP53 P04637 1/20 0.36
PLA2G4A P47712 1/20 0.36
LMNA P02545 2/20 0.35
KCNH2 Q12809 2/20 0.35
NPC1 O15118 1/20 0.35
RAB9A P51151 1/20 0.35
SMN1; SMN2 Q16637 1/20 0.35
SCN1A P35498 2/20 0.35
SCN2A Q99250 2/20 0.35
SCN3A Q9NY46 2/20 0.35
TDP1 Q9NUW8 1/20 0.35
L3MBTL1 Q9Y468 1/20 0.35
CHRM2 P08172 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27823090 0.95 LTA4H (0.41) LTA4HCASRTSHRTP53LMNA
SCHEMBL29690459 0.94 ALDH1A1 (0.38) LTA4HCASRTSHRPLA2G4ALMNA
SCHEMBL28035370 0.93 NPC1 (0.42) LTA4HCASRTSHRTP53LMNA
SCHEMBL6678195 0.93 NPC1 (0.42) LTA4HCASRTSHRTP53LMNA
SCHEMBL28034839 0.93 NPC1 (0.42) LTA4HCASRTSHRTP53LMNA
SCHEMBL6541581 0.93 NPC1 (0.42) LTA4HCASRTSHRTP53LMNA
SCHEMBL28035407 0.93 NPC1 (0.42) LTA4HCASRTSHRTP53LMNA
SCHEMBL6541323 0.93 NPC1 (0.42) LTA4HCASRTSHRTP53LMNA
SCHEMBL28035383 0.93 NPC1 (0.42) LTA4HCASRTSHRTP53LMNA
SCHEMBL28034887 0.93 NPC1 (0.42) LTA4HCASRTSHRTP53LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 42 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-10279509-A None JP disclosed
EP-4714992-A1 POLYTETRAMETHYLENE GLYCOL-BASED (METH)ACRYLATE COMPOUND Cemedine Co., Ltd. (JP) 2026-03-25 EP disclosed
US-20250154361-A1 RECESS FILLING MATERIAL KIT, CURED PRODUCT THEREOF, AND RECESS FILLING METHOD RESONAC CORPORATION (JP) 2025-05-15 US disclosed
WO-2025074954-A1 ADHESIVE COMPOSITION セメダイン株式会社 2025-04-10 WO disclosed
WO-2025033491-A1 PIPE LINING MATERIAL, CURED PRODUCT OF PIPE LINING MATERIAL, AND METHOD FOR PRODUCING CURED PRODUCT OF PIPE LINING MATERIAL 株式会社レゾナック 2025-02-13 WO disclosed
WO-2025033489-A1 PIPE LINING MATERIAL, CURED PRODUCT OF PIPE LINING MATERIAL, AND METHOD FOR PRODUCING CURED PRODUCT OF PIPE LINING MATERIAL 株式会社レゾナック 2025-02-13 WO disclosed
WO-2025033488-A1 METHOD FOR PRODUCING CURED PRODUCT OF RESIN COMPOSITION 株式会社レゾナック 2025-02-13 WO disclosed
WO-2025033399-A1 ACRYLIC ADHESIVE COMPOSITION セメダイン株式会社 2025-02-13 WO disclosed
WO-2025033490-A1 METHOD FOR PRODUCING CURED PRODUCT OF RESIN COMPOSITION 株式会社レゾナック 2025-02-13 WO disclosed
WO-2024242005-A1 POLYTETRAMETHYLENE GLYCOL-BASED (METH)ACRYLATE COMPOUND セメダイン株式会社 2024-11-28 WO disclosed
CN-109863179-A Free-radical polymerised resin combination 昭和电工株式会社 2019-06-07 CN disclosed
CN-107428855-B Radically polymerizable resin composition, method for curing same, method for producing same, use of radically polymerizable resin composition, and method for using same 昭和电工株式会社 2019-03-15 CN disclosed
EP-3228637-B1 RADICAL-POLYMERIZABLE RESIN COMPOSITION, CURING METHOD THEREOF, METHOD OF PRODUCING SAME, USE OF RADICAL-POLYMERIZABLE RESIN COMPOSITION, AND USE METHOD OF THEREOF SHOWA DENKO KK (JP) 2019-02-20 EP disclosed
US-9969836-B2 Radical-polymerizable resin composition, curing method thereof, method of producing same, use of radical-polymerizable resin composition, and use method of thereof SHOWA DENKO K.K. (JP) 2018-05-15 US disclosed
US-20180009926-A1 RADICAL-POLYMERIZABLE RESIN COMPOSITION, CURING METHOD THEREOF, METHOD OF PRODUCING SAME, USE OF RADICAL-POLYMERIZABLE RESIN COMPOSITION, AND USE METHOD OF THEREOF SHOWA DENKO K.K. (JP) 2018-01-11 US disclosed
CN-107428855-A Radically polymerizable resin composition, method for curing same, method for producing same, use of radically polymerizable resin composition, and method for using same 昭和电工株式会社 2017-12-01 CN disclosed
EP-3228637-A1 RADICAL-POLYMERIZABLE RESIN COMPOSITION, CURING METHOD THEREOF, METHOD OF PRODUCING SAME, USE OF RADICAL-POLYMERIZABLE RESIN COMPOSITION, AND USE METHOD OF THEREOF Showa Denko K.K. (JP) 2017-10-11 EP disclosed
CN-105008483-A Sheet-adhesive resin composition, laminate, protective sheet for solar cell, and module for solar cell TOYO INK SC HOLDINGS CO LTD 2015-10-28 CN disclosed
US-20040001961-A1 Curable resin composition useful for coating, multi-layer printed wiring board, printed wiring board and dry film TAMURA KAKEN CORPORATION (JP) 2004-01-01 US disclosed
JP-H10279509-A PRODUCTION OF PARA-OR META-HYDROXYALKYLBENZENE AND ITS INTERMEDIATE HOKKO CHEM IND CO LTD 1998-10-20 JP disclosed