SCHEMBL29706111

SCHEMBL29706111

CCCCO[Bi]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL49555 0.76 ADRB2 (0.45)
SCHEMBL4075267 0.76 ADRB2 (0.45)
SCHEMBL702931 0.76 ADRB2 (0.39)
SCHEMBL703974 0.76 ADRB2 (0.39)
Ammonia Solution, Strong SCHEMBL27834149 0.74 ADRB2 (0.38)
SCHEMBL706862 0.74 ADRB2 (0.38)
SCHEMBL702433 0.74 ADRB2 (0.38)
SCHEMBL704162 0.74 ADRB2 (0.38)
SCHEMBL705072 0.74 ADRB2 (0.38)
SCHEMBL9796521 0.73 ADRB2 (0.43)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260118767-A1 REVERSE PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-04-30 US disclosed
EP-4621486-A2 POLYVALENT AMMONIUM SALT COMPOUND, COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM, AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-09-24 EP disclosed
US-20250289931-A1 POLYVALENT AMMONIUM SALT COMPOUND, COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM, AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-09-18 US disclosed
EP-4592299-A1 SILICON-CONTAINING SULFONIUM SALT COMPOUND, COMPOSITION FOR FORMING A SILICON-CONTAINING RESIST UNDERLAYER FILM, AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-07-30 EP disclosed
US-20250237953-A1 SILICON-CONTAINING SULFONIUM SALT COMPOUND, COMPOSITION FOR FORMING A SILICON-CONTAINING RESIST UNDERLAYER FILM, AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-07-24 US disclosed
US-12332565-B2 Thermosetting iodine- and silicon-containing material, composition containing the material for forming resist underlayer film for EUV lithography, and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-06-17 US disclosed
US-12332567-B2 Composition for forming silicon-containing resist underlayer film, patterning process, and silicon compound SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-06-17 US disclosed
CN-112526822-B Composition for forming silicon-containing resist underlayer film and pattern forming method 信越化学工业株式会社 2025-02-28 CN disclosed
US-12174541-B2 Composition for forming silicon-containing resist underlayer film and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-12-24 US disclosed
CN-112286000-B Composition for forming silicon-containing resist underlayer film and pattern forming method 信越化学工业株式会社 2024-12-03 CN disclosed
EP-3686256-B1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM AND PATTERNING PROCESS SHINETSU CHEMICAL CO (JP) 2023-06-28 EP disclosed
EP-4020081-B1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM, PATTERNING PROCESS, AND SILICON COMPOUND SHINETSU CHEMICAL CO (JP) 2023-05-17 EP disclosed
CN-111423587-B Thermosetting silicon-containing compound, composition for forming silicon-containing film, and method for forming pattern 信越化学工业株式会社 2023-01-31 CN disclosed
US-11485824-B2 Thermosetting silicon-containing compound, composition for forming a silicon-containing film, and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2022-11-01 US disclosed
US-11480879-B2 Composition for forming silicon-containing resist underlayer film and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2022-10-25 US disclosed
US-20220282100-A1 METAL OXIDE FILM-FORMING COMPOSITION, AND METHOD FOR PRODUCING METAL OXIDE FILM USING THE SAME TOKYO OHKA KOGYO CO., LTD. (JP) 2022-09-08 US disclosed
US-20220274912-A1 METAL OXIDE FILM-FORMING COMPOSITION, METHOD FOR PRODUCING METAL OXIDE FILM USING THE SAME, TERTIARY ALKYLOXYCARBONYL GROUP-MODIFIED BISNAPHTHOL FLUORENE COMPOUND, AND METHOD FOR PRODUCING THE SAME TOKYO OHKA KOGYO CO., LTD. (JP) 2022-09-01 US disclosed
US-20220221793-A1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM, PATTERNING PROCESS, AND SILICON COMPOUND SHIN-ETSU CHEMICAL CO., LTD. (JP) 2022-07-14 US disclosed
US-11385544-B2 Composition for forming silicon-containing resist underlayer film and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2022-07-12 US disclosed
EP-4020081-A1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM, PATTERNING PROCESS, AND SILICON COMPOUND Shin-Etsu Chemical Co., Ltd. (JP) 2022-06-29 EP disclosed