SCHEMBL297250

SCHEMBL297250

NCCCC(=O)OC(=O)CN

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP1A2 P05177 2/20 0.52
LMNA P02545 3/20 0.46
TSHR P16473 3/20 0.46
THRB P10828 2/20 0.46
BLM P54132 2/20 0.46
KMT2A Q03164 2/20 0.46
NPSR1 Q6W5P4 2/20 0.46
GABRR3 A8MPY1 1/20 0.46
GABRP O00591 1/20 0.46
GABRD O14764 1/20 0.46
HDAC3 O15379 1/20 0.46
GABBR2 O75899 1/20 0.46
GABRA1 P14867 1/20 0.46
GABRB1 P18505 1/20 0.46
GABRG2 P18507 1/20 0.46
GABRR1 P24046 1/20 0.46
GABRB3 P28472 1/20 0.46
GABRR2 P28476 1/20 0.46
SLC6A1 P30531 1/20 0.46
GABRA5 P31644 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrochloric Acid SCHEMBL25178227 0.98 CYP1A2 (0.50) CYP1A2LMNATSHRTHRBBLM
SCHEMBL20010546 0.92 CYP1A2 (0.58) CYP1A2LMNATSHRTHRBBLM
SCHEMBL5364699 0.91 LMNA (0.50) CYP1A2LMNATSHRTHRBBLM
SCHEMBL15658062 0.90 ALDH1A1 (0.43) CYP1A2LMNATSHRTHRBBLM
SCHEMBL29453876 0.87 ALDH1A1 (0.42) CYP1A2LMNATSHRTHRBBLM
SCHEMBL10678886 0.87 CYP1A2 (0.54) CYP1A2LMNATSHRTHRBBLM
SCHEMBL7257426 0.85 LMNA (0.54) CYP1A2LMNATSHRTHRBBLM
Potassium SCHEMBL29453861 0.85 ALDH1A1 (0.40) CYP1A2LMNATSHRTHRBKMT2A
SCHEMBL1537202 0.84 ALDH1A1 (0.43) CYP1A2LMNATSHRTHRBBLM
SCHEMBL887119 0.84 NFKB1 (0.55) CYP1A2LMNATSHRTHRBBLM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4829078-A CEREBRAL EDEMA ONO PHARMACEUTICAL CO., LTD. (JP) 1989-05-09 US claimed
EP-2614123-B1 AQUEOUS POLISHING COMPOSITION AND PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATE MATERIALS FOR ELECTRICAL, MECHANICAL AND OPTICAL DEVICES BASF SE (DE) 2017-06-28 EP disclosed
US-20130200039-A1 AQUEOUS POLISHING COMPOSITIONS CONTAINING N-SUBSTITUTED DIAZENIUM DIOXIDES AND/OR N'-HYDROXY-DIAZENIUM OXIDE SALTS BASF SE (DE) 2013-08-08 US disclosed
EP-2614123-A1 AQUEOUS POLISHING COMPOSITION AND PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATE MATERIALS FOR ELECTRICAL, MECHANICAL AND OPTICAL DEVICES BASF SE (DE) 2013-07-17 EP disclosed
EP-2613910-A1 PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATES CONTAINING SILICON OXIDE DIELECTRIC FILMS AND POLYSILICON AND/OR SILICON NITRIDE FILMS BASF SE (DE) 2013-07-17 EP disclosed
EP-2614122-A1 AQUEOUS POLISHING COMPOSITIONS CONTAINING N-SUBSTITUTED DIAZENIUM DIOXIDES AND/OR N'-HYDROXY-DIAZENIUM OXIDE SALTS BASF SE (DE) 2013-07-17 EP disclosed
CN-103210047-A Aqueous polishing compositions containing N-substituted diazenium dioxides and/or N'-hydroxy-diazenium oxide salts BASF SE 2013-07-17 CN disclosed
US-20130168348-A1 AQUEOUS POLISHING COMPOSITION AND PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATES CONTAINING SILICON OXIDE DIELECTRIC AND POLYSILICON FILMS BASF SE (DE) 2013-07-04 US disclosed
US-20130171824-A1 PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATES CONTAINING SILICON OXIDE DIELECTRIC FILMS AND POLYSILICON AND/OR SILICON NITRIDE FILMS BASF SE (DE) 2013-07-04 US disclosed
CN-103189457-A Aqueous polishing composition and process for chemically mechanically polishing substrate materials for electrical, mechanical and optical devices BASF SE 2013-07-03 CN disclosed
US-20130161285-A1 AQUEOUS POLISHING COMPOSITION AND PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATE MATERIALS FOR ELECTRICAL, MECHANICAL AND OPTICAL DEVICES BASF SE (DE) 2013-06-27 US disclosed
WO-2012032469-A1 AQUEOUS POLISHING COMPOSITION AND PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATE MATERIALS FOR ELECTRICAL, MECHANICAL AND OPTICAL DEVICES BASF SE (DE) 2012-03-15 WO disclosed
WO-2012032467-A1 PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATES CONTAINING SILICON OXIDE DIELECTRIC FILMS AND POLYSILICON AND/OR SILICON NITRIDE FILMS BASF SE (DE) 2012-03-15 WO disclosed
WO-2012032451-A1 AQUEOUS POLISHING COMPOSITION AND PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATES CONTAINING SILICON OXIDE DIELECTRIC AND POLYSILICON FILMS BASF SE (DE) 2012-03-15 WO disclosed
WO-2012032466-A1 AQUEOUS POLISHING COMPOSITIONS CONTAINING N-SUBSTITUTED DIAZENIUM DIOXIDES AND/OR N'-HYDROXY-DIAZENIUM OXIDE SALTS BASF SE (DE) 2012-03-15 WO disclosed
EP-2428541-A1 Aqueous polishing composition and process for chemically mechanically polishing substrates containing silicon oxide dielectric and polysilicon films BASF SE (DE) 2012-03-14 EP disclosed
WO-1995003321-A1 METHOD FOR ENDOMODIFICATION OF PROTEINS BIONEBRASKA, INC. (US) 1995-02-02 WO disclosed