Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGLL | Q99685 | 11/20 | 0.55 |
| ▸ | TLR9 | Q9NR96 | 3/20 | 0.46 |
| ▸ | NR1H2 | P55055 | 1/20 | 0.43 |
| ▸ | FAAH | O00519 | 1/20 | 0.41 |
| ▸ | G6PD | P11413 | 1/20 | 0.38 |
| ▸ | TSHR | P16473 | 1/20 | 0.36 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.36 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.36 |
| ▸ | HTT | P42858 | 1/20 | 0.36 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.36 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.35 |
| ▸ | PKM | P14618 | 1/20 | 0.35 |
| ▸ | CCR6 | P51684 | 1/20 | 0.35 |
| ▸ | ATM | Q13315 | 1/20 | 0.35 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.35 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.35 |
| ▸ | HTR1A | P08908 | 1/20 | 0.35 |
| ▸ | SLC6A2 | P23975 | 1/20 | 0.35 |
| ▸ | SLC6A4 | P31645 | 1/20 | 0.35 |
| ▸ | SLC6A3 | Q01959 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29754826 | 1.00 | MGLL (0.55) | MGLLTLR9NR1H2FAAHG6PD | |
| SCHEMBL29754607 | 0.87 | MGLL (0.65) | MGLLTLR9NR1H2FAAHG6PD | |
| SCHEMBL29191813 | 0.84 | MGLL (0.41) | MGLLTLR9NR1H2FAAHG6PD | |
| SCHEMBL9578160 | 0.83 | MGLL (0.49) | MGLLTLR9NR1H2FAAHG6PD | |
| SCHEMBL2814012 | 0.82 | MGLL (0.62) | MGLLTLR9NR1H2FAAHTSHR | |
| SCHEMBL29191805 | 0.82 | G6PD (0.48) | MGLLTLR9FAAHG6PDALDH1A1 | |
| SCHEMBL8405341 | 0.80 | MGLL (0.44) | MGLLTLR9NR1H2FAAHTSHR | |
| SCHEMBL9564015 | 0.79 | MGLL (0.58) | MGLLTLR9NR1H2FAAHG6PD | |
| SCHEMBL9320871 | 0.79 | MGLL (0.71) | MGLLTLR9NR1H2FAAHG6PD | |
| SCHEMBL8506269 | 0.77 | MGLL (0.53) | MGLLTLR9NR1H2FAAHTSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0579434-B1 | Dialkyl peroxide, cross-linking composition containing the same, method for cross-linking, and electric power cable | NOF CORP (JP) | 1995-10-18 | — | — | EP | claimed |
| JP-57002327-A | — | — | None | — | — | JP | disclosed |
| JP-6132426-A | — | — | None | — | — | JP | disclosed |
| US-20240247107-A1 | CROSS-LINKABLE ORGANOSILOXANE-MODIFIED REACTION RESINS | WACKER CHEMIE AG (DE) | 2024-07-25 | — | — | US | disclosed |
| EP-4347702-A1 | CROSS-LINKABLE ORGANOSILOXANE-MODIFIED REACTION RESINS | Wacker Chemie AG (DE) | 2024-04-10 | — | — | EP | disclosed |
| EP-4153658-B1 | CROSS-LINKABLE ORGANOSILOXANE-MODIFIED REACTION RESINS | WACKER CHEMIE AG (DE) | 2023-12-06 | — | — | EP | disclosed |
| US-20230272164-A1 | CROSS-LINKABLE ORGANOSILOXANE-MODIFIED REACTION RESINS | WACKER CHEMIE AG (DE) | 2023-08-31 | — | — | US | disclosed |
| CN-112062914-B | Resin composition, prepreg and laminated board prepared from same | 常熟生益科技有限公司 | 2023-06-06 | — | — | CN | disclosed |
| EP-4153658-A1 | CROSS-LINKABLE ORGANOSILOXANE-MODIFIED REACTION RESINS | Wacker Chemie AG (DE) | 2023-03-29 | — | — | EP | disclosed |
| CN-115698139-A | Crosslinkable organosiloxane-modified reaction resins | 瓦克化学股份公司 | 2023-02-03 | — | — | CN | disclosed |
| WO-2022253413-A1 | CROSS-LINKABLE ORGANOSILOXANE-MODIFIED REACTION RESINS | WACKER CHEMIE AG (DE) | 2022-12-08 | — | — | WO | disclosed |
| CN-112079763-B | Modified maleimide compound, and prepreg and laminated board manufactured by using same | 苏州生益科技有限公司 | 2022-07-05 | — | — | CN | disclosed |
| CN-112079763-A | Modified maleimide compound, and prepreg and laminated board manufactured by using same | 苏州生益科技有限公司 | 2020-12-15 | — | — | CN | disclosed |
| US-6849385-B2 | Photosensitive resin composition, process of forming patterns with the same, and electronic components | HITACHI CHEMICAL CO., LTD. (JP) | 2005-02-01 | — | — | US | disclosed |
| US-20040180286-A1 | Photosensitive resin composition, process of forming patterns with the same, and electronic components | HITACHI CHEMICAL CO., LTD. (JP) | 2004-09-16 | — | — | US | disclosed |
| US-5532105-A | HAVING GOOD ADHESION TO PLATED COPPER | HITACHI CHEMICAL COMPANY, LTD. (JP) | 1996-07-02 | — | — | US | disclosed |
| JP-H06132426-A | SEMICONDUCTOR DEVICE | NITTO DENKO CORP | 1994-05-13 | — | — | JP | disclosed |
| JP-S572327-A | THERMOSETTING RESIN COMPOSITION | HITACHI LTD | 1982-01-07 | — | — | JP | disclosed |