Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PGR | P06401 | 13/20 | 0.50 |
| ▸ | CYP2A6 | P11509 | 2/20 | 0.41 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.41 |
| ▸ | POLB | P06746 | 1/20 | 0.39 |
| ▸ | CYP11B2 | P19099 | 1/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3619202 | 0.89 | PGR (0.58) | PGRCYP2A6ALDH1A1 | |
| SCHEMBL29038978 | 0.80 | PGR (0.55) | PGRCYP11B2 | |
| SCHEMBL15043549 | 0.78 | PGR (0.44) | PGRCYP2A6ALDH1A1POLB | |
| SCHEMBL29098900 | 0.77 | CFTR (0.50) | PGRALDH1A1POLB | |
| SCHEMBL11549695 | 0.77 | MAOB (0.38) | — | |
| SCHEMBL344102 | 0.75 | ESR2 (0.42) | ALDH1A1 | |
| SCHEMBL2188047 | 0.74 | HDAC8 (0.31) | — | |
| SCHEMBL29790334 | 0.73 | PGR (0.84) | PGRALDH1A1 | |
| SCHEMBL2189042 | 0.73 | CYP1A1 (0.35) | PGR | |
| SCHEMBL703760 | 0.72 | CYP2A6 (0.46) | PGRCYP2A6ALDH1A1POLB |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-120092029-A | Resin composition, cured product, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board | 三菱瓦斯化学株式会社 | 2025-06-03 | — | — | CN | disclosed |
| CN-114787120-B | Compound and method for producing same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2024-08-09 | — | — | CN | disclosed |
| CN-118251445-A | Cyclic organosiloxane containing imide bond and polymerizable unsaturated bond and curable resin composition containing the same | 信越化学工业株式会社 | 2024-06-25 | — | — | CN | disclosed |
| CN-112236464-B | Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board | 三菱瓦斯化学株式会社 | 2024-02-23 | — | — | CN | disclosed |
| CN-112204076-B | Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board | 三菱瓦斯化学株式会社 | 2023-10-24 | — | — | CN | disclosed |
| CN-116813824-A | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2023-09-29 | — | — | CN | disclosed |
| CN-113646393-B | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2023-09-19 | — | — | CN | disclosed |
| CN-116490555-A | Copper-clad laminate and printed circuit board | 三菱瓦斯化学株式会社 | 2023-07-25 | — | — | CN | disclosed |
| CN-116490350-A | Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed wiring board | 三菱瓦斯化学株式会社 | 2023-07-25 | — | — | CN | disclosed |
| CN-113348079-B | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2023-06-02 | — | — | CN | disclosed |
| CN-114787276-A | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2022-07-22 | — | — | CN | disclosed |