SCHEMBL2979707

SCHEMBL2979707

C=C(F)C(=O)OCCC(F)(F)C(F)(F)C(F)(F)C(F)(F)F

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5889533 0.98 THRB (0.32)
SCHEMBL4611994 0.98 THRB (0.32)
SCHEMBL5889485 0.87
SCHEMBL13894748 0.86 THRB (0.37)
SCHEMBL26114076 0.86 MEN1 (0.31)
SCHEMBL156101 0.86 THRB (0.44)
SCHEMBL13744718 0.86
SCHEMBL3371971 0.86
SCHEMBL2462841 0.84 THRB (0.43)
SCHEMBL1536824 0.84 THRB (0.43)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7031589-B2 Material for attenuating light signals with low reflectance in a fiber optic network FURUKAWA ELECTRIC NORTH AMERICA (US) 2006-04-18 US claimed
US-20040264908-A1 Material for attenuating light signals with low reflectance in a fiber optic network FURUKAWA ELECTRIC NORTH AMERICA, INC. 2004-12-30 US claimed
CN-115803350-B Method for producing hollow fine particles and hollow fine particles 大金工业株式会社 2025-02-25 CN disclosed
WO-2023189969-A1 RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN 日本ゼオン株式会社 2023-10-05 WO disclosed
US-20230144395-A1 MANUFACTURING METHOD FOR HOLLOW FINE PARTICLES, AND HOLLOW FINE PARTICLES DAIKIN INDUSTRIES, LTD. (JP) 2023-05-11 US disclosed
EP-4166579-A1 MANUFACTURING METHOD FOR HOLLOW FINE PARTICLES, AND HOLLOW FINE PARTICLES Daikin Industries, Ltd. (JP) 2023-04-19 EP disclosed
EP-3967715-A1 HOLLOW FINE PARTICLE PRODUCTION METHOD AND HOLLOW FINE PARTICLES Daikin Industries, Ltd. (JP) 2022-03-16 EP disclosed
US-20210397097-A1 METHOD OF PRODUCING MOLDED PRODUCT, RESIST FOR COLLECTIVE MOLDING WITH IMPRINT-ELECTRONIC LITHOGRAPHY, METHOD OF PRODUCING REPLICA MOLD, METHOD OF PRODUCING DEVICE, AND IMPRINT MATERIAL TOKYO UNIVERSITY OF SCIENCE FOUNDATION (JP) 2021-12-23 US disclosed
EP-3832695-A1 MOLDED ARTICLE MANUFACTURING METHOD, IMPRINT-ELECTRONIC WRITING COLLECTIVE MOLDING RESIST, REPLICA MOLD MANUFACTURING METHOD, DEVICE MANUFACTURING METHOD, AND IMPRINT MATERIAL Tokyo University of Science Foundation (JP) 2021-06-09 EP disclosed
EP-3410209-B1 METHOD OF FORMING RESIST PATTERN ZEON CORP (JP) 2021-03-10 EP disclosed
US-10809618-B2 Method of forming resist pattern ZEON CORPORATION (JP) 2020-10-20 US disclosed
EP-1652901-B1 SILICON-CONTAINING FLUOROCHEMICAL SURFACE-TREATING AGENT DAIKIN IND LTD (JP) 2012-08-15 EP disclosed
US-7776982-B2 Interpolymer of an alpha-substituted acrylate having a fluoroalkyl group and optionally perfluoroalkoxy units and an unsaturated terminated siloxane; imparts excellent water repellency, oil repellency, soil resistance and feeling to textiles, particularly carpets DAIKIN INDUSTRIES, LTD. (JP) 2010-08-17 US disclosed
US-7569323-B2 Resist protective coating material and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2009-08-04 US disclosed
US-20070026341-A1 Resist protective coating material and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-02-01 US disclosed
US-20060134439-A1 Silicon-containing fluorochemical surface-treating agent DAIKIN INDUSTRIES, LTD. (JP) 2006-06-22 US disclosed
EP-1652901-A1 SILICON-CONTAINING FLUOROCHEMICAL SURFACE-TREATING AGENT Daikin Industries, Ltd. (JP) 2006-05-03 EP disclosed
US-7031589-B2 Material for attenuating light signals with low reflectance in a fiber optic network FURUKAWA ELECTRIC NORTH AMERICA (US) 2006-04-18 US disclosed
US-20040264908-A1 Material for attenuating light signals with low reflectance in a fiber optic network FURUKAWA ELECTRIC NORTH AMERICA, INC. 2004-12-30 US disclosed
EP-0632059-A2 Interpenetrating networks from unsaturated monomers and thermosetting resins SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1995-01-04 EP disclosed