Styrene

Styrene

SCHEMBL2988659

C=Cc1cc[n+](C)cc1.C=Cc1ccccc1

nearest known ligand 0.82

Full drug profile on Sugi Atlas →

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
▸ HDAC8 Q9BY41 3/20 0.82
▸ CHAT P28329 7/20 0.68
▸ ALDH1A1 P00352 4/20 0.64
▸ TSHR P16473 1/20 0.64
▸ SLC22A2 O15244 1/20 0.50
▸ SLC22A1 O15245 1/20 0.50
▸ SLC22A3 O75751 1/20 0.50
▸ SLC6A4 P31645 1/20 0.50
▸ KDM4E B2RXH2 2/20 0.44
▸ RAB9A P51151 2/20 0.44
▸ GLA P06280 1/20 0.44
▸ MAPT P10636 1/20 0.44
▸ SMN1; SMN2 Q16637 1/20 0.44
▸ APOBEC3A P31941 1/20 0.44
▸ APOBEC3G Q9HC16 1/20 0.44
▸ ACHE P22303 1/20 0.42
▸ HPGD P15428 1/20 0.41
▸ CYP2C19 P33261 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL271363 0.91 — —
Water SCHEMBL9141383 0.88 HDAC8 (0.95) HDAC8CHATALDH1A1TSHRSLC22A2
Bromide SCHEMBL366167 0.88 HDAC8 (0.95) HDAC8CHATALDH1A1TSHRSLC22A2
Iodide SCHEMBL994764 0.88 HDAC8 (0.95) HDAC8CHATALDH1A1TSHRKDM4E
Hydrochloric Acid SCHEMBL541687 0.88 HDAC8 (0.95) HDAC8CHATALDH1A1TSHRKDM4E
Iodide SCHEMBL11496800 0.86 HDAC8 (0.90) HDAC8CHATALDH1A1TSHRKDM4E
SCHEMBL3318878 0.81 CHAT (1.00) HDAC8CHATALDH1A1SLC22A2SLC22A1
SCHEMBL9777568 0.81 CHAT (1.00) HDAC8CHATALDH1A1SLC22A2SLC22A1
Styrene SCHEMBL7160606 0.80 ALDH1A1 (0.88) HDAC8CHATALDH1A1TSHRGLA
Styrene SCHEMBL8336803 0.80 ALDH1A1 (0.88) HDAC8CHATALDH1A1TSHRGLA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4407659-A1 BASE MATERIAL WHICH IS USED FOR ADHESIVE SHEET FOR PROCESSING SEMICONDUCTOR WAFER HAVING PROJECTED PART Denka Company Limited (JP) 2024-07-31 — — EP disclosed
CN-118077037-A Substrate for adhesive sheet for processing semiconductor wafer having convex portion 电化株式会社 2024-05-24 — — CN disclosed
WO-2023188714-A1 ADHESIVE TAPE AND PROCESSING METHOD デンカ株式会社 2023-10-05 — — WO disclosed
US-20230230870-A1 WAFER PROCESSING SHEET AND WAFER PROCESSING METHOD DENKA COMPANY LIMITED (JP) 2023-07-20 — — US disclosed
WO-2023068088-A1 BASE MATERIAL WHICH IS USED FOR ADHESIVE SHEET FOR PROCESSING SEMICONDUCTOR WAFER HAVING PROJECTED PART デンカ株式会社 2023-04-27 — — WO disclosed
CN-115039206-A Sheet for wafer processing and method for processing wafer 电化株式会社 2022-09-09 — — CN disclosed
US-9586388-B2 Chip-resistant film NICHIBAN CO., LTD. (JP) 2017-03-07 — — US disclosed
US-20150090391-A1 CHIP-RESISTANT FILM NICHIBAN CO., LTD. 2015-04-02 — — US disclosed
EP-1964671-B1 TIPPING FILM NICHIBAN KK (JP) 2014-03-26 — — EP disclosed
US-20100167049-A1 Chip-Resistant Film NICHIBAN CO., LTD. (JP) 2010-07-01 — — US disclosed
EP-1964671-A1 TIPPING FILM Nichiban Co. Ltd. (JP) 2008-09-03 — — EP disclosed
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