SCHEMBL2989031

SCHEMBL2989031

Nc1cccc(-c2cc(N)ccc2-c2ccccc2-c2ccccc2)c1

nearest known ligand 0.57

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAOA P21397 1/20 0.57
ALDH1A1 P00352 5/20 0.50
MEN1 O00255 3/20 0.50
LMNA P02545 3/20 0.50
HPGD P15428 3/20 0.50
KMT2A Q03164 3/20 0.50
PTPRC P08575 2/20 0.50
NPC1 O15118 2/20 0.50
RAB9A P51151 2/20 0.50
SMN1; SMN2 Q16637 2/20 0.50
NCOA1 Q15788 2/20 0.50
APAF1 O14727 1/20 0.50
TDP2 O95551 1/20 0.50
NSD2 O96028 1/20 0.50
PLA2G1B P04054 1/20 0.50
POLB P06746 1/20 0.50
CTSL P07711 1/20 0.50
ALOX12 P18054 1/20 0.50
PLCG1 P19174 1/20 0.50
CTSS P25774 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1099351 1.00 MAOA (0.57) MAOAALDH1A1MEN1LMNAHPGD
SCHEMBL9550987 0.96 MAOA (0.57) MAOAALDH1A1MEN1LMNAHPGD
SCHEMBL8341652 0.96 MAOA (0.57) MAOAALDH1A1MEN1LMNAHPGD
SCHEMBL756118 0.96 MAOA (0.61) MAOAALDH1A1MEN1LMNAHPGD
SCHEMBL4395100 0.92 ALDH1A1 (0.57) MAOAALDH1A1MEN1LMNAHPGD
SCHEMBL29637424 0.92 ALDH1A1 (0.57) MAOAALDH1A1MEN1LMNAHPGD
SCHEMBL30545213 0.92 ALDH1A1 (0.57) MAOAALDH1A1MEN1LMNAHPGD
SCHEMBL30449021 0.90 MAOA (0.70) MAOAALDH1A1MEN1LMNAHPGD
SCHEMBL7642404 0.90 MAOA (0.70) MAOAALDH1A1MEN1LMNAHPGD
SCHEMBL29726725 0.90 MAOA (0.70) MAOAALDH1A1MEN1LMNAHPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 199 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260147277-A1 TRANSFER FILM, PATTERN FORMING METHOD, LAMINATE, AND SEMICONDUCTOR PACKAGE FUJIFILM CORPORATION (JP) 2026-05-28 US disclosed
EP-3893054-B1 PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE FUJIFILM CORP (JP) 2026-05-06 EP disclosed
EP-3633455-B1 PHOTOSENSITIVE RESIN COMPOSITION, POLYMERIC PRECURSOR, CURED FILM, LAMINATE, CURED FILM PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE FUJIFILM CORP (JP) 2026-04-08 EP disclosed
EP-3859447-B1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE FUJIFILM CORP (JP) 2025-11-19 EP disclosed
US-12473403-B2 Curable resin composition, cured film, laminate, method for manufacturing cured film, semiconductor device, and polymer precursor FUJIFILM CORPORATION (JP) 2025-11-18 US disclosed
US-12422750-B2 Method of manufacturing cured film, photocurable resin composition, method of manufacturing laminate, and method of manufacturing semiconductor device FUJIFILM CORPORATION (JP) 2025-09-23 US disclosed
US-20250264801-A1 RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2025-08-21 US disclosed
US-12393116-B2 Pattern forming method, photosensitive resin composition, cured film, laminate, and device FUJIFILM CORPORATION (JP) 2025-08-19 US disclosed
EP-4596608-A1 RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM Corporation (JP) 2025-08-06 EP disclosed
EP-4597225-A1 FILM PRODUCTION METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT PRODUCTION METHOD, CURED PRODUCT, AND LAMINATE FUJIFILM Corporation (JP) 2025-08-06 EP disclosed
US-20180079864-A1 POLYIMIDE PRECURSOR COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM, A SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING POLYIMIDE PRECURSOR COMPOSITION FUJIFILM CORPORATION (JP) 2018-03-22 US disclosed
US-20170101521-A1 THERMAL BASE GENERATOR, THERMOSETTING RESIN COMPOSITION, CURED FILM, CURED FILM MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2017-04-13 US disclosed
US-8956732-B2 Polyamideimide resin, adhesive agent, material for flexible substrate, flexible laminate, and flexible print wiring board HITACHI CHEMICAL COMPANY, LTD. (JP) 2015-02-17 US disclosed
US-20100170701-A1 POLYAMIDEIMIDE RESIN, ADHESIVE AGENT, MATERIAL FOR FLEXIBLE SUBSTRATE, FLEXIBLE LAMINATE, AND FLEXIBLE PRINT WIRING BOARD HITACHI CHEMICAL COMPANY, LTD. (JP) 2010-07-08 US disclosed
EP-2070961-A1 POLYAMIDEIMIDE RESIN, ADHESIVE AGENT, MATERIAL FOR FLEXIBLE SUBSTRATE, FLEXIBLE LAMINATE, AND FLEXIBLE PRINT WIRING BOARD Hitachi Chemical Company, Ltd. (JP) 2009-06-17 EP disclosed
EP-1070590-A2 Ink jet head and production method of the same KONICA CORPORATION (JP) 2001-01-24 EP disclosed
EP-0770638-B1 Polyimide compositions for electrodeposition and coatings formed of the same ITATANI HIROSHI (JP) 1999-06-02 EP disclosed
US-5741599-A Polyimide compositions for electrodeposition and coatings formed of the same PI MATERIALS RESEARCH LABORATORY (JP) 1998-04-21 US disclosed
EP-0770638-A1 Polyimide compositions for electrodeposition and coatings formed of the same PI MATERIAL RESEARCH LABORATORY (JP) 1997-05-02 EP disclosed
US-4079082-A Lasing dyes derived from ter-and quaterphenyl THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE NAVY (US) 1978-03-14 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260147277-A1 TRANSFER FILM, PATTERN FORMING METHOD, LAMINATE, AND SEMICONDUCTOR PACKAGE LCP1, PCNA, FDFT1 MAOA 3371/4885ALDH1A1 3998/4885MEN1 3594/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.