Sorbitol

Sorbitol

SCHEMBL2990055

C=C.OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)CO

nearest known ligand 0.85

Full drug profile on Sugi Atlas →

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
LMNA P02545 3/20 0.85
L3MBTL1 Q9Y468 1/20 0.85
TDP1 Q9NUW8 2/20 0.79
KDM4E B2RXH2 2/20 0.52
PDE4A P27815 1/20 0.52
USP2 O75604 1/20 0.48
SLCO1B1 Q9Y6L6 1/20 0.48
ALDH1A1 P00352 2/20 0.39
MAPT P10636 1/20 0.37
TOP1 P11387 1/20 0.35
MGAM O43451 2/20 0.33
SI P14410 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Mannitol SCHEMBL8057003 1.00 LMNA (0.85) LMNAL3MBTL1TDP1KDM4EPDE4A
Mannitol SCHEMBL25230964 1.00 LMNA (0.85) LMNAL3MBTL1TDP1KDM4EPDE4A
Mannitol SCHEMBL27414221 0.96 LMNA (0.79) LMNAL3MBTL1TDP1KDM4EPDE4A
Mannitol SCHEMBL2477078 0.92 LMNA (1.00) LMNAL3MBTL1TDP1KDM4EPDE4A
Sorbitol SCHEMBL763 0.92 LMNA (1.00) LMNAL3MBTL1TDP1KDM4EPDE4A
Mannitol SCHEMBL2297640 0.92 LMNA (1.00) LMNAL3MBTL1TDP1KDM4EPDE4A
Mannitol SCHEMBL13187369 0.92 LMNA (1.00) LMNAL3MBTL1TDP1KDM4EPDE4A
Mannitol SCHEMBL20594082 0.92 LMNA (1.00) LMNAL3MBTL1TDP1KDM4EPDE4A
Mannitol SCHEMBL20594083 0.92 LMNA (1.00) LMNAL3MBTL1TDP1KDM4EPDE4A
Mannitol SCHEMBL23066399 0.92 LMNA (1.00) LMNAL3MBTL1TDP1KDM4EPDE4A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 31 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20090238846-A1 S/O type external preparation ASPION CO., LTD. (JP) 2009-09-24 US claimed
EP-1785131-A1 EXTERNAL PREPARATION OF S/O TYPE ASPION CO., LTD. (JP) 2007-05-16 EP claimed
US-11591505-B2 High density fluid for completion applications TERVES, LLC (US) 2023-02-28 US disclosed
US-11525078-B2 Non-toxic high-density fluid for completion applications TERVES, LLC (US) 2022-12-13 US disclosed
US-20210292633-A1 HIGH DENSITY FLUID FOR COMPLETION APPLICATIONS Terves, Inc. 2021-09-23 US disclosed
US-11078393-B2 Non-toxic high-density fluid for completion applications TERVES, LLC (US) 2021-08-03 US disclosed
US-20210230468-A1 NON-TOXIC HIGH-DENSITY FLUID FOR COMPLETION APPLICATIONS TERVES, LLC 2021-07-29 US disclosed
WO-2021125174-A1 OIL-IN-WATER TYPE EMULSION COSMETIC FOR SKIN CARE USING ELECTROPHORESIS 株式会社 資生堂 2021-06-24 WO disclosed
WO-2021039909-A1 METHOD FOR ENHANCING LUMINOUS INTENSITY OF FLUORESCENT DYE 国立大学法人高知大学 2021-03-04 WO disclosed
WO-2021014759-A1 PHOTOSENSITIVE COLORED RESIN COMPOSITION, CURED OBJECT, BANK, AND IMAGE DISPLAY DEVICE 三菱ケミカル株式会社 2021-01-28 WO disclosed
WO-2019079144-A1 NON-TOXIC HIGH DENSITY FLUID FOR COMPLETION APPLICATIONS Terves Inc. (US) 2019-04-25 WO disclosed
WO-2007116776-A1 MANUFACTURING METHOD OF RECORDING MEDIUM, INKJET RECORDING MEDIUM, AND METHOD OF MANUFACTURING THE SAME FUJIFILM CORPORATION (JP) 2007-10-18 WO disclosed
US-7217447-B2 Ink-jet recording sheet FUJIFILM CORPORATION (JP) 2007-05-15 US disclosed
US-20070093183-A1 CERIUM OXIDE SLURRY, CERIUM OXIDE POLISHING SLURRY AND METHOD FOR POLISHING SUBSTRATE USING THE SAME HITACHI CHEMICAL CO., LTD. (JP) 2007-04-26 US disclosed
EP-0948997-B1 Manufacturing method of absorbent resin NIPPON CATALYTIC CHEM IND (JP) 2005-07-20 EP disclosed
US-20040202837-A1 Ink-jet recording sheet FUJI PHOTO FILM CO., LTD. 2004-10-14 US disclosed
EP-1329331-A2 Ink-jet recording sheet FUJI PHOTO FILM CO., LTD. (JP) 2003-07-23 EP disclosed
US-6291636-B1 DRYING HYDROGEL OF A CROSSLINKED POLYMER; PULVERIZING; SEPARATING NIPPON SHOKUBAI CO., LTD. (JP) 2001-09-18 US disclosed
US-6258857-B1 CHEMICAL FOR DISPENSING, DISPERSE SOLUTION, ACRYLIC ACID POLYMER AND ALKALI WITH SILICA KYOWA INDUSTRIAL CO., LTD. (JP) 2001-07-10 US disclosed
EP-0948997-A2 Manufacturing method of absorbent resin Nippon Shokubai Co., Ltd. (JP) 1999-10-13 EP disclosed