SCHEMBL29930288

SCHEMBL29930288

C#Cc1ccc2c(c1)C(=O)OC2=O

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALOX15 P16050 1/20 0.46
TDP1 Q9NUW8 1/20 0.46
ALDH1A1 P00352 1/20 0.44
GRM5 P41594 2/20 0.38
CA12 O43570 2/20 0.36
CA1 P00915 2/20 0.36
CA2 P00918 1/20 0.36
CA9 Q16790 1/20 0.36
CA14 Q9ULX7 1/20 0.36
GABRA1 P14867 3/20 0.35
GABRA5 P31644 3/20 0.35
GABRA2 P47869 3/20 0.35
GABRB2 P47870 3/20 0.35
GABRA3 P34903 2/20 0.35
GABRG2 P18507 1/20 0.35
GABRB3 P28472 1/20 0.35
LOXL2 Q9Y4K0 1/20 0.35
TYMS P04818 2/20 0.34
CA4 P22748 1/20 0.33
CA7 P43166 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL278397 1.00 ALOX15 (0.46) ALOX15TDP1ALDH1A1GRM5CA12
SCHEMBL3447240 0.85 ALOX15 (0.40) ALOX15TDP1ALDH1A1CA12CA1
SCHEMBL2640689 0.83 GRM5 (0.53) ALOX15TDP1ALDH1A1GRM5TYMS
SCHEMBL3448236 0.82 CHEK1 (0.43) ALOX15TDP1ALDH1A1CA12CA1
SCHEMBL9611211 0.81 GRM5 (0.56) ALOX15TDP1ALDH1A1GRM5
SCHEMBL2209314 0.81 ALOX15 (0.48) ALOX15TDP1ALDH1A1GRM5CA1
SCHEMBL3447859 0.81 MAOA (0.45) ALOX15TDP1ALDH1A1
SCHEMBL24636740 0.79 CA12 (0.43) ALOX15TDP1ALDH1A1CA12CA1
SCHEMBL3448063 0.79 CA12 (0.42) ALOX15TDP1ALDH1A1CA12CA1
SCHEMBL12314488 0.79 ALOX15 (0.46) ALOX15TDP1ALDH1A1GRM5CA12

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119081644-A Amino hyperbranched polysiloxane modified unsaturated polyimide high-temperature-resistant adhesive and preparation method thereof 南京大学 2024-12-06 CN claimed
WO-2024150578-A1 HEAT-CURABLE RESIN COMPOSITION, CURED PRODUCT, AND ELECTRONIC COMPONENT JNC株式会社 2024-07-18 WO claimed
CN-118867395-B Electrolyte additive, electrolyte and high-nickel secondary battery 深圳市豪鹏科技股份有限公司 2025-02-18 CN disclosed
CN-118867395-A Electrolyte additive, electrolyte and high-nickel secondary battery 深圳市豪鹏科技股份有限公司 2024-10-29 CN disclosed
CN-118685032-A Resin composition 罗门哈斯电子材料有限公司 2024-09-24 CN disclosed
CN-118684886-A Photosensitive media 罗门哈斯电子材料有限公司 2024-09-24 CN disclosed
WO-2024150578-A1 HEAT-CURABLE RESIN COMPOSITION, CURED PRODUCT, AND ELECTRONIC COMPONENT JNC株式会社 2024-07-18 WO disclosed
EP-4055083-A1 REACTIVE POLYAMIDEIMIDE OLIGOMERS, METHODS, AND ARTICLES The University of North Carolina at Chapel Hill (US) 2022-09-14 EP disclosed
EP-4055084-A1 REACTIVE OLIGOMERS, ADDITIVE MANUFACTURING METHODS, AND ARTICLES THEREOF The University of North Carolina at Chapel Hill (US) 2022-09-14 EP disclosed