⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30460656 | 0.85 | — | — | |
| SCHEMBL29939377 | 0.81 | CA2 (0.35) | — | |
| SCHEMBL31427194 | 0.80 | GABRA1 (0.32) | — | |
| SCHEMBL29907318 | 0.77 | MRGPRX4 (0.34) | — | |
| SCHEMBL30575161 | 0.75 | MEN1 (0.32) | — | |
| SCHEMBL29666948 | 0.75 | ALDH1A1 (0.37) | — | |
| SCHEMBL29636335 | 0.74 | CA2 (0.37) | — | |
| SCHEMBL29358274 | 0.73 | ALDH1A1 (0.33) | — | |
| SCHEMBL30879800 | 0.73 | ALDH1A1 (0.33) | — | |
| SCHEMBL29418932 | 0.73 | ALDH1A1 (0.33) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20250382444-A1 | RESIN COMPOSITION AND MOLDED ARTICLE OF SAME | DENKA COMPANY LTD (JP) | 2025-12-18 | — | — | US | disclosed |
| EP-4545598-A1 | RESIN COMPOSITION AND MOLDED ARTICLE OF SAME | Denka Company Limited (JP) | 2025-04-30 | — | — | EP | disclosed |
| US-20240199867-A1 | RESIN COMPOSITION FOR MOLDED ARTICLE TO BE PAINTED WITH WATER-BASED PAINT AND MOLDED ARTICLE MOLDED FROM SAME | DENKA COMPANY LIMITED (JP) | 2024-06-20 | — | — | US | disclosed |
| US-20240124697-A1 | RESIN COMPOSITION AND MOLDED ARTICLE | DENKA COMPANY LIMITED (JP) | 2024-04-18 | — | — | US | disclosed |
| EP-4332171-A1 | RESIN COMPOSITION FOR MOLDED ARTICLE PAINTED WITH WATER-BASED PAINT AND MOLDED ARTICLE MOLDED FROM SAME | Denka Company Limited (JP) | 2024-03-06 | — | — | EP | disclosed |
| EP-4328250-A1 | RESIN COMPOSITION AND MOLDED ARTICLE | Denka Company Limited (JP) | 2024-02-28 | — | — | EP | disclosed |
| CN-117178018-A | Resin composition and molded article | 电化株式会社 | 2023-12-05 | — | — | CN | disclosed |
| WO-2022230294-A1 | RESIN COMPOSITION FOR MOLDED ARTICLE PAINTED WITH WATER-BASED PAINT AND MOLDED ARTICLE MOLDED FROM SAME | デンカ株式会社 | 2022-11-03 | — | — | WO | disclosed |
| WO-2022224686-A1 | RESIN COMPOSITION AND MOLDED ARTICLE | デンカ株式会社 | 2022-10-27 | — | — | WO | disclosed |