SCHEMBL29963312

SCHEMBL29963312

Cc1ccc2c(OC(=O)C3CCCCC3C(=O)O)c3cc(C)ccc3c(OC(=O)C3CCCCC3C(=O)O)c2c1

nearest known ligand 0.47

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
▸ GLA P06280 1/20 0.46
▸ LMNA P02545 2/20 0.44
▸ GAA P10253 1/20 0.40
▸ MEN1 O00255 2/20 0.39
▸ KMT2A Q03164 2/20 0.39
▸ PKM P14618 1/20 0.39
▸ ALDH1A1 P00352 1/20 0.38
▸ SIRT1 Q96EB6 1/20 0.37
▸ SMN1; SMN2 Q16637 2/20 0.37
▸ KDM4E B2RXH2 2/20 0.37
▸ HTT P42858 1/20 0.37
▸ CYP2C19 P33261 1/20 0.36
▸ NPSR1 Q6W5P4 1/20 0.36
▸ PTGDR2 Q9Y5Y4 1/20 0.36
▸ TSHR P16473 1/20 0.35
▸ RECQL P46063 1/20 0.35
▸ HSD17B10 Q99714 1/20 0.35
▸ GRM4 Q14833 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29963377 0.96 LMNA (0.44) GLALMNAGAAMEN1KMT2A
SCHEMBL29963307 0.96 LMNA (0.44) GLALMNAGAAMEN1KMT2A
SCHEMBL28894804 0.87 GLA (0.41) GLALMNAGAAMEN1KMT2A
SCHEMBL28895037 0.84 KDM4E (0.42) GLALMNAGAAMEN1KMT2A
SCHEMBL29963246 0.84 KDM4E (0.42) GLALMNAGAAMEN1KMT2A
SCHEMBL28894332 0.84 KDM4E (0.42) GLALMNAGAAMEN1KMT2A
SCHEMBL28895046 0.83 TDP1 (0.41) LMNAGAAALDH1A1SMN1; SMN2KDM4E
SCHEMBL29963209 0.83 GABRA1 (0.39) LMNAGAAALDH1A1SMN1; SMN2KDM4E
SCHEMBL29963402 0.83 SLC6A2 (0.42) LMNAGAAMEN1KMT2AALDH1A1
SCHEMBL29963927 0.82 KDM4E (0.48) LMNAGAAMEN1KMT2AALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115380075-B Epoxy resin composition for sealing semiconductor 纳美仕有限公司 2024-06-18 — — CN disclosed
CN-115380075-A Epoxy resin composition for semiconductor encapsulation 纳美仕有限公司 2022-11-22 — — CN disclosed
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