SCHEMBL30002999

SCHEMBL30002999

O=c1n(CO)c(=O)n(CCO)c(=O)n1CO

nearest known ligand 0.42

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
PDE4A P27815 2/20 0.36
PDE4B Q07343 2/20 0.36
PDE4C Q08493 2/20 0.36
PDE4D Q08499 2/20 0.36
HSD17B10 Q99714 1/20 0.35
KMT2A Q03164 2/20 0.34
ALDH1A1 P00352 1/20 0.33
LMNA P02545 1/20 0.33
APEX1 P27695 1/20 0.32
KDM4E B2RXH2 1/20 0.32
MEN1 O00255 1/20 0.32
CYP3A4 P08684 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21163108 1.00 PDE4A (0.36) PDE4APDE4BPDE4CPDE4DHSD17B10
SCHEMBL35878 0.91 PDE4A (0.39) PDE4APDE4BPDE4CPDE4DHSD17B10
Formaldehyde SCHEMBL8709282 0.86 CYP3A4 (0.38) PDE4APDE4BPDE4CPDE4DHSD17B10
SCHEMBL151883 0.85 CYP3A4 (0.38) APEX1CYP3A4
SCHEMBL15428923 0.81 PDE4A (0.35) PDE4APDE4BPDE4CPDE4DHSD17B10
SCHEMBL13788796 0.81 PDE4A (0.40) PDE4APDE4BPDE4CPDE4DHSD17B10
SCHEMBL2730449 0.81 PDE4A (0.41) PDE4APDE4BPDE4CPDE4DHSD17B10
SCHEMBL9718199 0.80 HSD17B10 (0.36) PDE4APDE4BPDE4CPDE4DHSD17B10
SCHEMBL20738815 0.79 PDE4A (0.53) PDE4APDE4BPDE4CPDE4DHSD17B10
SCHEMBL13917311 0.79 PDE4A (0.53) PDE4APDE4BPDE4CPDE4DHSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023085103-A1 ADHESIVE, LAMINATE, AND PACKAGING MATERIAL DIC株式会社 2023-05-19 WO disclosed
WO-2022239667-A1 METHOD FOR PRODUCING LAMINATE DIC株式会社 2022-11-17 WO disclosed
WO-2022220151-A1 TWO-PACK CURABLE ADHESIVE COMPOSITION, ANCHOR COATING MATERIAL, ADHESIVE, LAMINATE, AND PACKAGING MATERIAL DIC株式会社 2022-10-20 WO disclosed