SCHEMBL30274237

SCHEMBL30274237

O=Nc1c(O)ccc2nsnc12

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GAA P10253 2/20 0.38
PKM P14618 1/20 0.38
MAPT P10636 5/20 0.38
MEN1 O00255 2/20 0.38
KMT2A Q03164 2/20 0.38
CDC7 O00311 1/20 0.38
PLK4 O00444 1/20 0.38
DAPK3 O43293 1/20 0.38
DYRK3 O43781 1/20 0.38
ROCK2 O75116 1/20 0.38
PRKD3 O94806 1/20 0.38
MAP4K4 O95819 1/20 0.38
ABL1 P00519 1/20 0.38
PRKCG P05129 1/20 0.38
INSR P06213 1/20 0.38
FYN P06241 1/20 0.38
RET P07949 1/20 0.38
IGF1R P08069 1/20 0.38
ROS1 P08922 1/20 0.38
PIM1 P11309 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20266316 0.74 MAPT (0.44) GAAPKMMAPTMEN1KMT2A
SCHEMBL28386309 0.71 MAPT (0.41) GAAPKMMAPTMEN1KMT2A
SCHEMBL15032485 0.71 MAPT (0.60) GAAPKMMAPTMEN1KMT2A
SCHEMBL17582666 0.71 MAPT (0.50) GAAPKMMAPTMEN1KMT2A
SCHEMBL11673614 0.70 MAPT (0.56) GAAPKMMAPTMEN1KMT2A
SCHEMBL13526111 0.67 ACHE (0.36) GAAPKMMAPTMEN1KMT2A
SCHEMBL3632810 0.66 MAPT (0.57) GAAPKMMAPTMEN1KMT2A
SCHEMBL9735482 0.66 CDK1 (0.39) MAPTALDH1A1HPGDKDM4EPOLB
Ammonia Solution, Strong SCHEMBL11086067 0.64 MAPT (0.55) GAAPKMMAPTMEN1KMT2A
SCHEMBL2922254 0.64 HSP90AA1 (0.50) PKMMAPTMEN1KMT2AIGF1R

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250188225-A1 THERMALLY-CONDUCTIVE ADDITION-CURABLE SILICONE COMPOSITION AND CURED PRODUCT THEREOF SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-06-12 US disclosed
US-20250171636-A1 TWO-COMPONENT THERMALLY-CONDUCTIVE ADDITION-CURABLE SILICONE COMPOSITION AND CURED PRODUCT THEREOF SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-05-29 US disclosed
EP-4491672-A1 THERMALLY-CONDUCTIVE ADDITION-CURABLE SILICONE COMPOSITION AND CURED PRODUCT THEREOF SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-01-15 EP disclosed
EP-4491673-A1 TWO-COMPONENT THERMALLY-CONDUCTIVE ADDITION-CURABLE SILICONE COMPOSITION AND CURED PRODUCT THEREOF SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-01-15 EP disclosed
WO-2023171352-A1 THERMALLY-CONDUCTIVE ADDITION-CURABLE SILICONE COMPOSITION AND CURED PRODUCT THEREOF 信越化学工業株式会社 2023-09-14 WO disclosed
WO-2023171353-A1 TWO-COMPONENT THERMALLY-CONDUCTIVE ADDITION-CURABLE SILICONE COMPOSITION AND CURED PRODUCT THEREOF 信越化学工業株式会社 2023-09-14 WO disclosed
CN-115729037-A Cured product, laminate, semiconductor device, method for producing same, resin composition, and compound 富士胶片株式会社 2023-03-03 CN disclosed