SCHEMBL30309873

SCHEMBL30309873

O=C1OC(=O)c2cc(CCCCCCCCc3ccc4c(c3)C(=O)OC4=O)ccc21

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALOX15 P16050 3/20 0.44
TDP1 Q9NUW8 2/20 0.44
ALDH1A1 P00352 2/20 0.43
MAOA P21397 1/20 0.42
MAOB P27338 1/20 0.42
GPR3 P46089 1/20 0.39
CDK1 P06493 1/20 0.38
IGF1R P08069 2/20 0.38
L3MBTL1 Q9Y468 2/20 0.36
NPC1 O15118 1/20 0.36
LMNA P02545 1/20 0.36
MAPT P10636 1/20 0.36
MAPK1 P28482 1/20 0.36
RAB9A P51151 1/20 0.36
SMN1; SMN2 Q16637 1/20 0.36
LPL P06858 1/20 0.35
LIPG Q9Y5X9 1/20 0.35
KCNJ1 P48048 1/20 0.35
KCNH2 Q12809 1/20 0.35
HDAC1 Q13547 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30309875 1.00 ALOX15 (0.44) ALOX15TDP1ALDH1A1MAOAMAOB
SCHEMBL20251159 1.00 ALOX15 (0.44) ALOX15TDP1ALDH1A1MAOAMAOB
SCHEMBL10001961 1.00 ALOX15 (0.44) ALOX15TDP1ALDH1A1MAOAMAOB
SCHEMBL20251188 1.00 ALOX15 (0.44) ALOX15TDP1ALDH1A1MAOAMAOB
SCHEMBL20251190 1.00 ALOX15 (0.44) ALOX15TDP1ALDH1A1MAOAMAOB
SCHEMBL17250898 1.00 ALOX15 (0.44) ALOX15TDP1ALDH1A1MAOAMAOB
SCHEMBL20251161 0.98 ALOX15 (0.46) ALOX15TDP1ALDH1A1MAOAMAOB
SCHEMBL6407464 0.91 GPR3 (0.51) ALDH1A1GPR3LMNALPLLIPG
SCHEMBL8344457 0.91 GPR3 (0.51) ALDH1A1GPR3LMNALPLLIPG
SCHEMBL8340236 0.91 GPR3 (0.51) ALDH1A1GPR3LMNALPLLIPG

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250019582-A1 POLYAMIC ACID VARNISH, POLYIMIDE COMPOSITION, AND ADHESIVE MITSUI CHEMICALS, INC. (JP) 2025-01-16 US disclosed
WO-2024210105-A1 METHOD FOR PRODUCING SEMICONDUCTOR DEVICE AND LAYERED OBJECT FOR SEMICONDUCTOR DEVICE 三井化学株式会社 2024-10-10 WO disclosed
EP-4424749-A1 POLYAMIC ACID VARNISH, POLYIMIDE COMPOSITION, AND ADHESIVE Mitsui Chemicals, Inc. (JP) 2024-09-04 EP disclosed
CN-118176241-A Polyamic acid varnish, polyimide composition, and adhesive 三井化学株式会社 2024-06-11 CN disclosed
WO-2023074534-A1 POLYAMIC ACID VARNISH, POLYIMIDE COMPOSITION, AND ADHESIVE 三井化学株式会社 2023-05-04 WO disclosed