Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | AMY1A | P0DUB6 | 1/20 | 1.00 |
| ▸ | HIF1A | Q16665 | 4/20 | 0.55 |
| ▸ | CYP2C9 | P11712 | 3/20 | 0.55 |
| ▸ | CYP2C19 | P33261 | 3/20 | 0.55 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.53 |
| ▸ | HSPA5 | P11021 | 3/20 | 0.50 |
| ▸ | TRPA1 | O75762 | 1/20 | 0.48 |
| ▸ | ALOX15 | P16050 | 4/20 | 0.47 |
| ▸ | LMNA | P02545 | 3/20 | 0.47 |
| ▸ | HPGD | P15428 | 3/20 | 0.47 |
| ▸ | HTT | P42858 | 2/20 | 0.47 |
| ▸ | MEN1 | O00255 | 2/20 | 0.47 |
| ▸ | MAPT | P10636 | 2/20 | 0.47 |
| ▸ | ALOX12 | P18054 | 2/20 | 0.47 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.47 |
| ▸ | SLC22A1 | O15245 | 1/20 | 0.47 |
| ▸ | USP2 | O75604 | 1/20 | 0.47 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.47 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.47 |
| ▸ | HSPD1 | P10809 | 1/20 | 0.47 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1345563 | 1.00 | AMY1A (1.00) | AMY1AHIF1ACYP2C9CYP2C19SMN1; SMN2 | |
| SCHEMBL29623092 | 1.00 | AMY1A (1.00) | AMY1AHIF1ACYP2C9CYP2C19SMN1; SMN2 | |
| SCHEMBL218957 | 1.00 | AMY1A (1.00) | AMY1AHIF1ACYP2C9CYP2C19SMN1; SMN2 | |
| SCHEMBL3820165 | 1.00 | AMY1A (1.00) | AMY1AHIF1ACYP2C9CYP2C19SMN1; SMN2 | |
| SCHEMBL1345917 | 1.00 | AMY1A (1.00) | AMY1AHIF1ACYP2C9CYP2C19SMN1; SMN2 | |
| SCHEMBL18352 | 1.00 | AMY1A (1.00) | AMY1AHIF1ACYP2C9CYP2C19SMN1; SMN2 | |
| SCHEMBL1345514 | 1.00 | AMY1A (1.00) | AMY1AHIF1ACYP2C9CYP2C19SMN1; SMN2 | |
| Phosphine SCHEMBL26919025 | 0.98 | AMY1A (0.96) | AMY1AHIF1ACYP2C9CYP2C19SMN1; SMN2 | |
| Formaldehyde SCHEMBL28912209 | 0.94 | AMY1A (0.89) | AMY1AHIF1ACYP2C9CYP2C19SMN1; SMN2 | |
| SCHEMBL211105 | 0.93 | AMY1A (0.86) | AMY1AHIF1ACYP2C9CYP2C19SMN1; SMN2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4633804-A1 | PROCESS FOR PREPARING ALPHA,BETA-UNSATURATED CARBONYL COMPOUND | Firmenich SA (CH) | 2025-10-22 | — | — | EP | disclosed |
| CN-119620544-A | Photosensitive resin composition, dry film, photosensitive dry film, resist film, molded substrate with mold, and method for producing plated molded article | 东京应化工业株式会社 | 2025-03-14 | — | — | CN | disclosed |
| CN-118295211-A | Positive photosensitive resin composition, method for forming pattern by photoresist, and printed circuit board | 深圳市容大感光科技股份有限公司 | 2024-07-05 | — | — | CN | disclosed |
| WO-2024126769-A1 | PROCESS FOR PREPARING ALPHA,BETA-UNSATURATED CARBONYL COMPOUND | FIRMENICH SA (CH) | 2024-06-20 | — | — | WO | disclosed |
| CN-113646052-B | Reversible thermochromic composition, reversible thermochromic microcapsule pigment, and writing instrument | 百乐墨水株式会社 | 2024-05-17 | — | — | CN | disclosed |
| CN-117850163-A | Positive photosensitive resin composition, method for forming pattern by photoresist, and printed circuit board | 深圳市容大感光科技股份有限公司 | 2024-04-09 | — | — | CN | disclosed |
| CN-111205648-B | Curable composition, cured product, microlens, and optical element | 东京应化工业株式会社 | 2023-12-08 | — | — | CN | disclosed |
| CN-116360213-A | Resin composition and photoresist patterning method using the same | 深圳市容大感光科技股份有限公司 | 2023-06-30 | — | — | CN | disclosed |
| CN-113785023-B | Water-based ink composition for reversible thermochromic writing instrument, refill for refill and water-based ballpoint pen incorporating same | 株式会社百乐 | 2023-05-12 | — | — | CN | disclosed |
| CN-106933034-B | Positive photoresist composition | 东京应化工业株式会社 | 2023-01-06 | — | — | CN | disclosed |