SCHEMBL30320324

SCHEMBL30320324

Cc1cc(Cc2ccc(O)c(O)c2O)c(O)c(Cc2ccc(O)c(O)c2O)c1

nearest known ligand 0.69

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
AMY1A P0DUB6 1/20 0.69
CYP2C9 P11712 3/20 0.52
CYP2C19 P33261 3/20 0.52
HIF1A Q16665 3/20 0.52
SMN1; SMN2 Q16637 1/20 0.52
HSPA5 P11021 1/20 0.48
CYP2D6 P10635 1/20 0.42
HSD17B10 Q99714 1/20 0.42
SELL P14151 1/20 0.39
SELP P16109 1/20 0.39
SELE P16581 1/20 0.39
CETP P11597 1/20 0.37
TRPA1 O75762 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL686350 1.00 AMY1A (0.69) AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2
SCHEMBL8092782 0.91 AMY1A (0.58) AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2
SCHEMBL8575625 0.88 AMY1A (0.56) AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2
SCHEMBL7757417 0.87 AMY1A (0.54) AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2
SCHEMBL7796816 0.86 AMY1A (0.72) AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2
SCHEMBL8066841 0.86 AMY1A (0.67) AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2
SCHEMBL35864 0.82 HSPA5 (0.43) AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2
SCHEMBL29368767 0.82 HSPA5 (0.43) AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2
SCHEMBL14447159 0.82 AMY1A (0.56) AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2
SCHEMBL18352 0.82 AMY1A (1.00) AMY1ACYP2C9CYP2C19HIF1ASMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119998728-A Film manufacturing method, photosensitive resin composition, cured product manufacturing method, cured product, and laminate 富士胶片株式会社 2025-05-13 CN disclosed
CN-117099045-A Negative photosensitive resin composition, cured product, laminate, method for producing cured product, and semiconductor device 富士胶片株式会社 2023-11-21 CN disclosed
CN-106933034-B Positive photoresist composition 东京应化工业株式会社 2023-01-06 CN disclosed