SCHEMBL3034902

SCHEMBL3034902

O=C1C=CC=CC1=O.[N-]=[N+]=NNS(=O)(=O)N=[N+]=[N-]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Naphthoquinone SCHEMBL27486918 0.80 IDO1 (0.44)
SCHEMBL5586196 0.77
SCHEMBL5604952 0.77
1,2-Naphthoquinone SCHEMBL3027882 0.75 PTPRC (0.54)
SCHEMBL3034904 0.73 CA1 (0.33)
SCHEMBL27601001 0.68
SCHEMBL26677 0.66
SCHEMBL28758879 0.63
SCHEMBL11357834 0.61 CA1 (0.38)
SCHEMBL28734829 0.61

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8409783-B2 Copolymer, resin composition, spacer for display panel, planarization film, thermosetting protective film, microlens, and process for producing copolymer TOKYO OHKA KOGYO CO., LTD. (JP) 2013-04-02 US disclosed
CN-102459416-A Method for producing polyhydroxyimide NISSAN CHEMICAL IND LTD 2012-05-16 CN disclosed
CN-1841197-B X-ray sensitive resin composition, protruded body and barrier body formed thereby, forming method thereof and liquid crystal display element JSR CORP 2011-07-06 CN disclosed
CN-1760757-B Radioactivity sensitive resin composition SUMITOMO CHEMICAL CO 2010-11-10 CN disclosed
CN-1760758-B Radioactivity sensitive resin composition SUMITOMO CHEMICAL CO 2010-11-03 CN disclosed
US-20100209847-A1 COPOLYMER, RESIN COMPOSITION, SPACER FOR DISPLAY PANEL, PLANARIZATION FILM, THERMOSETTING PROTECTIVE FILM, MICROLENS, AND PROCESS FOR PRODUCING COPOLYMER TOKYO OHKA KOGYO CO., LTD. (JP) 2010-08-19 US disclosed
CN-100336137-C Composition for forming photosensitive dielectric material, and transfer film, dielectric material and electronic parts using the same JSR CORP (JP) 2007-09-05 CN disclosed
CN-1841197-A X-ray sensitive resin composition, protruded body and barrier body formed thereby, forming method thereof and liquid crystal display element JSR CORP (JP) 2006-10-04 CN disclosed
CN-1841194-A X-ray sensitive resin composition, protruded body and barrier body formed thereby and liquid crystal display element JSR CORP (JP) 2006-10-04 CN disclosed
CN-1272669-C Radiation sensitive resin composite, method for forming insulating film having pattern, active matrix plate and panel display equipped with the film and method for producing panel display device SHARP KK (JP) 2006-08-30 CN disclosed
CN-1760756-A Radioactivity sensitive resin composition SUMITOMO CHEMICAL CO (JP) 2006-04-19 CN disclosed
CN-1760757-A Radioactivity sensitive resin composition SUMITOMO CHEMICAL CO (JP) 2006-04-19 CN disclosed
CN-1760758-A Radioactivity sensitive resin composition SUMITOMO CHEMICAL CO (JP) 2006-04-19 CN disclosed
CN-1505820-A Composition for forming photosensitive dielectric, and decal film, dielectric and electronic component using the same ������ʱ����ʽ���� 2004-06-16 CN disclosed
CN-1479173-A Radiation sensitive resin composite, method for forming insulating film having pattern, active matrix plate and panel display equipped with the film and method for producing panel display device 夏普株式会社 2004-03-03 CN disclosed
EP-0301101-B1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION NIPPON PAINT CO., LTD. (JP) 1993-06-23 EP disclosed
EP-0301101-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION NIPPON PAINT CO., LTD. (JP) 1989-02-01 EP disclosed