SCHEMBL3036341

SCHEMBL3036341

Cc1nc(CCNC(N)=O)c[nH]1

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MTNR1A P48039 5/20 0.40
MTNR1B P49286 3/20 0.40
NOTUM Q6P988 1/20 0.40
MAPT P10636 2/20 0.35
ALDH1A1 P00352 2/20 0.35
NPC1 O15118 2/20 0.35
RAB9A P51151 2/20 0.35
SMN1; SMN2 Q16637 1/20 0.35
QPCT Q16769 1/20 0.34
QPCTL Q9NXS2 1/20 0.34
LDHA P00338 1/20 0.33
NOS3 P29474 1/20 0.33
NOS1 P29475 1/20 0.33
NOS2 P35228 1/20 0.33
HTT P42858 2/20 0.33
TSHR P16473 1/20 0.32
ADORA2A P29274 1/20 0.32
ADORA1 P30542 1/20 0.32
MEN1 O00255 1/20 0.32
KMT2A Q03164 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3021075 0.86 MTNR1A (0.38) MTNR1AMTNR1BMAPTALDH1A1NPC1
SCHEMBL8806150 0.81 MTNR1A (0.42) MTNR1AMTNR1BMAPTTSHRMEN1
Hydrochloric Acid SCHEMBL7422768 0.76 CAPN1 (0.40) MTNR1AALDH1A1RAB9ASMN1; SMN2HTT
SCHEMBL7676177 0.75 HTT (0.44) MAPTALDH1A1RAB9ASMN1; SMN2HTT
SCHEMBL28573909 0.73
SCHEMBL3929708 0.72 KDM4E (0.42) MAPTALDH1A1SMN1; SMN2HTTTSHR
2-Methylhistamine SCHEMBL624809 0.72
SCHEMBL6105714 0.72
SCHEMBL9236840 0.72 HSD17B10 (0.35) MAPTALDH1A1SMN1; SMN2MEN1KMT2A
SCHEMBL30586310 0.72 SMN1; SMN2 (0.31) SMN1; SMN2NOS3NOS1NOS2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 192 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0942028-B1 Epoxy resin composition AJINOMOTO KK (JP) 2004-11-24 EP claimed
US-6232426-B1 BLEND CONTAINING A THIOL, COMPOUND, LATENT CURING AGENT AND BORATE EATER AJINOMOTO CO., INC. (JP) 2001-05-15 US claimed
EP-0421389-A2 Imidazole compound-containing hardening agent composition, method of preparing the same and thermosetting epoxy resin composition SOMAR CORPORATION (JP) 1991-04-10 EP claimed
JP-2075676-A None JP disclosed
JP-2034626-A None JP disclosed
EP-4748870-A1 EPOXY RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT Namics Corporation (JP) 2026-05-27 EP disclosed
EP-4748869-A1 EPOXY RESIN COMPOSITION, ADHESIVE AGENT, SEALING MATERIAL, CURED ARTICLE, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT Namics Corporation (JP) 2026-05-27 EP disclosed
WO-2026100231-A1 CURABLE RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT ナミックス株式会社 2026-05-15 WO disclosed
US-12577331-B2 Resin composition NAMICS CORPORATION (JP) 2026-03-17 US disclosed
EP-4692055-A1 THIOL COMPOUND AJINOMOTO CO., INC. (JP) 2026-02-11 EP disclosed
US-20260008904-A1 THIOL COMPOUND AJINOMOTO CO., INC. (JP) 2026-01-08 US disclosed
EP-0747399-A2 Adhesive tape for electronic parts and liquid adhesive TOMOEGAWA PAPER CO. LTD. (JP) 1996-12-11 EP disclosed
US-5500294-A MODIFIED ACRYLONITRILE-BUTADIENE COPOLYMER TOMOEGAWA PAPER CO., LTD. (JP) 1996-03-19 US disclosed
US-5494757-A BLEND OF A PIPERAZINYLETHYLAMIDOCARBONYL-CONTAINING BUTADIENE-ACRYLONITRILE TERPOLYMER AND A MALEIMIDE RESIN TOMOEGAWA PAPER CO., LTD. (JP) 1996-02-27 US disclosed
EP-0649892-A1 Adhesive tape for electronic parts and liquid adhesive TOMOEGAWA PAPER CO. LTD. (JP) 1995-04-26 EP disclosed
EP-0649893-A1 Adhesive tape for electronic parts and liquid adhesive TOMOEGAWA PAPER CO. LTD. (JP) 1995-04-26 EP disclosed
US-5244939-A Improved adhesion SOMAR CORPORATION (JP) 1993-09-14 US disclosed
EP-0421389-A2 Imidazole compound-containing hardening agent composition, method of preparing the same and thermosetting epoxy resin composition SOMAR CORPORATION (JP) 1991-04-10 EP disclosed
JP-H0275676-A THERMOSETTING EPOXY RESIN VARNISH MITSUBISHI PETROCHEM CO LTD 1990-03-15 JP disclosed
JP-H0234626-A INJECTION MOLDING MATERIAL MITSUBISHI PETROCHEM CO LTD 1990-02-05 JP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12577331-B2 Resin composition SEM1, MCCC2, GRIN1 MTNR1A 2644/4885MTNR1B 2623/4885NOTUM 3947/4885
US-20260008904-A1 THIOL COMPOUND CBR1, PSMA1, KAT2A MTNR1A 1885/4885MTNR1B 3014/4885NOTUM 1855/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.