SCHEMBL3021075

SCHEMBL3021075

Cc1nc(CCNC(=O)NCCc2c[nH]c(C)n2)c[nH]1

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MTNR1A P48039 4/20 0.38
MAPT P10636 5/20 0.36
SMN1; SMN2 Q16637 4/20 0.36
ALDH1A1 P00352 2/20 0.36
NPC1 O15118 2/20 0.36
RAB9A P51151 2/20 0.36
TSHR P16473 1/20 0.36
QPCT Q16769 1/20 0.36
QPCTL Q9NXS2 1/20 0.36
PABPC1 P11940 1/20 0.35
ALOX15 P16050 1/20 0.35
EPHX1 P07099 1/20 0.35
MTNR1B P49286 1/20 0.35
HTR3E A5X5Y0 2/20 0.34
HTR3B O95264 2/20 0.34
HTR3A P46098 2/20 0.34
HTR3D Q70Z44 2/20 0.34
HTR3C Q8WXA8 2/20 0.34
POLB P06746 1/20 0.34
TAS1R3 Q7RTX0 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3036341 0.86 MTNR1A (0.40) MTNR1AMAPTSMN1; SMN2ALDH1A1NPC1
SCHEMBL8806150 0.78 MTNR1A (0.42) MTNR1AMAPTTSHRMTNR1B
SCHEMBL3929708 0.75 KDM4E (0.42) MAPTSMN1; SMN2ALDH1A1TSHR
SCHEMBL6105714 0.75
SCHEMBL9236840 0.74 HSD17B10 (0.35) MAPTSMN1; SMN2ALDH1A1POLB
SCHEMBL30586310 0.74 SMN1; SMN2 (0.31) SMN1; SMN2
SCHEMBL3930088 0.74 NPSR1 (0.42) SMN1; SMN2ALDH1A1
SCHEMBL27220885 0.74 NOS3 (0.34)
Methane SCHEMBL28186516 0.73
Hydrochloric Acid SCHEMBL25439022 0.73 NPSR1 (0.41)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 59 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250075028-A1 FAST-CURE RESIN FORMULATIONS WITH CONSISTENT HANDLING CHARACTERISTICS CYTEC INDUSTRIES, INC. (US) 2025-03-06 US disclosed
US-12139575-B2 Fast-cure resin formulations with consistent handling characteristics CYTEC INDUSTRIES INC. (US) 2024-11-12 US disclosed
WO-2023286767-A1 THERMOCONDUCTIVE MATERIAL COMPOSITION 株式会社大阪ソーダ 2023-01-19 WO disclosed
CN-114174355-A Acrylic rubber, crosslinkable rubber composition, and cured rubber product 电化株式会社 2022-03-11 CN disclosed
US-10982029-B2 Acrylic rubber composition DENKA COMPANY LIMITED (JP) 2021-04-20 US disclosed
EP-3483213-B1 ACRYLIC RUBBER COMPOSITION DENKA COMPANY LTD (JP) 2021-04-07 EP disclosed
EP-3483212-B1 ACRYLIC RUBBER COMPOSITION DENKA COMPANY LTD (JP) 2021-03-10 EP disclosed
US-20210047460-A1 FAST-CURE RESIN FORMULATIONS WITH CONSISTENT HANDLING CHARACTERISTICS CYTEC INDUSTRIES INC. 2021-02-18 US disclosed
US-20190300633-A1 ACRYLIC RUBBER COMPOSITION DENKA COMPANY LIMITED (JP) 2019-10-03 US disclosed
EP-3483212-A1 ACRYLIC RUBBER COMPOSITION Denka Company Limited (JP) 2019-05-15 EP disclosed
US-5609956-A (PIPERAZINYLETHYLAMINO)CARBONYL-CONTAINING ACRYLONITRILE-BUTADIENE COPOLYMER, MALEIMIDE COMPOUND TOMOEGAWA PAPER CO., LTD. (JP) 1997-03-11 US disclosed
EP-0747399-A2 Adhesive tape for electronic parts and liquid adhesive TOMOEGAWA PAPER CO. LTD. (JP) 1996-12-11 EP disclosed
US-5512628-A COMBINING A PIPERAZINYLETHYLAMINOCARBONYL-CONTAINING BUTADIENE-ACRYLONITRILE COPOLYMER WITH A MALEIMIDE CONTAINING COMPOUND IN AN ORGANIC SOLVENT; CURABLE TOMOEGAWA PAPER CO., LTD. (JP) 1996-04-30 US disclosed
US-5510189-A COMPRISING A PIPERAZINYLETHYLAMINOCARBONYL-CONTAINING BUTADIENE-ACRYLONITRILE COPOLYMER AND A MALEIMIDE COMPOUND; ADHERED AND CURED AT LOW TEMPERATURE; HEAT RESISTANCE TOMOEGAWA PAPER CO., LTD. (JP) 1996-04-23 US disclosed
US-5500294-A MODIFIED ACRYLONITRILE-BUTADIENE COPOLYMER TOMOEGAWA PAPER CO., LTD. (JP) 1996-03-19 US disclosed
US-5494757-A BLEND OF A PIPERAZINYLETHYLAMIDOCARBONYL-CONTAINING BUTADIENE-ACRYLONITRILE TERPOLYMER AND A MALEIMIDE RESIN TOMOEGAWA PAPER CO., LTD. (JP) 1996-02-27 US disclosed
US-5446080-A Piperazinylethylaminocarbonyl containing acrylonitrile-butadiene copolymer and bismaleimide compound TOMOEGAWA PAPER CO., LTD. (JP) 1995-08-29 US disclosed
EP-0651040-A1 Liquid adhesive for electronic parts and process for forming insulating adhesive layer using the same TOMOEGAWA PAPER CO. LTD. (JP) 1995-05-03 EP disclosed
EP-0649892-A1 Adhesive tape for electronic parts and liquid adhesive TOMOEGAWA PAPER CO. LTD. (JP) 1995-04-26 EP disclosed
EP-0649893-A1 Adhesive tape for electronic parts and liquid adhesive TOMOEGAWA PAPER CO. LTD. (JP) 1995-04-26 EP disclosed