SCHEMBL303940

SCHEMBL303940

Oc1ccc(C=CC=Cc2ccccc2)cc1

nearest known ligand 0.81

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
APP P05067 4/20 0.76
MAOB P27338 4/20 0.70
MAPT P10636 4/20 0.60
ALDH1A1 P00352 4/20 0.60
KDM4E B2RXH2 3/20 0.60
CYP3A4 P08684 4/20 0.53
KMT2A Q03164 4/20 0.53
PKM P14618 3/20 0.53
MEN1 O00255 3/20 0.53
HSPD1 P10809 2/20 0.53
HSPE1 P61604 2/20 0.53
NFKB1 P19838 2/20 0.53
RAB9A P51151 2/20 0.53
NFKB2 Q00653 2/20 0.53
RELA Q04206 2/20 0.53
CYP19A1 P11511 2/20 0.53
MAOA P21397 2/20 0.53
CYP1B1 Q16678 2/20 0.53
TDP1 Q9NUW8 2/20 0.53
ALDH2 P05091 1/20 0.53

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2631908 1.00 APP (0.76) APPMAOBMAPTALDH1A1KDM4E
SCHEMBL13359845 1.00 APP (0.76) APPMAOBMAPTALDH1A1KDM4E
Phenol SCHEMBL1743773 0.92 MAOB (0.74) APPMAOBMAPTALDH1A1KDM4E
(E)-4-Styrylphenol SCHEMBL716721 0.90 APP (0.61) APPMAOBMAPTALDH1A1KDM4E
(E)-4-Styrylphenol SCHEMBL27993 0.90 APP (0.61) APPMAOBMAPTALDH1A1KDM4E
SCHEMBL14038171 0.90 APP (0.61) APPMAOBMAPTALDH1A1KDM4E
SCHEMBL11439096 0.89 APP (0.94) APPMAOBMAPTALDH1A1KDM4E
4-Vinylphenol SCHEMBL28701079 0.89 APP (0.61) APPMAOBMAPTALDH1A1KDM4E
SCHEMBL5179114 0.89 APP (0.94) APPMAOBMAPTALDH1A1KDM4E
SCHEMBL11498215 0.89 APP (0.60) APPMAOBMAPTALDH1A1KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 197 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110117404-B Resin composition, and prepreg, metal foil laminate and printed wiring board produced using the same 台燿科技股份有限公司 2021-12-07 CN claimed
CN-109053944-B Polymer resin and application thereof in high-frequency circuit board 广东生益科技股份有限公司 2020-03-17 CN claimed
JP-6032838-A None JP disclosed
CN-117724293-A KrF negative photoresist, preparation method thereof and patterning method 北京科华微电子材料有限公司 2024-03-19 CN disclosed
US-11550221-B2 Chemically amplified positive-type photosensitive resin composition, photosensitive dry film, method of manufacturing photosensitive dry film, method of manufacturing patterned resist film, method of manufacturing substrate with template, method of manufacturing plated article, and nitrogen-containing aromatic heterocyclic compound TOKYO OHKA KOG YO CO., LTD. (JP) 2023-01-10 US disclosed
CN-110117404-B Resin composition, and prepreg, metal foil laminate and printed wiring board produced using the same 台燿科技股份有限公司 2021-12-07 CN disclosed
US-11061326-B2 Chemical amplification type positive photosensitive resin composition, a photosensitive dry film, a method for producing a photosensitive dry film, a method for producing a patterned resist film, a method of manufacturing a template with a substrate, and a method of manufacturing a plated shaped product, and a Mercapto compound TOKYO OHKA KOGYO CO., LTD. (JP) 2021-07-13 US disclosed
CN-108976706-B Epoxy resin composition, and prepreg and laminated board using same 广东生益科技股份有限公司 2021-06-04 CN disclosed
US-11022880-B2 Chemically amplified positive-type photosensitive resin composition, photosensitive dry film, method of manufacturing photosensitive dry film, method of manufacturing patterned resist film, method of manufacturing substrate with template, method of manufacturing plated article, and mercapto compound TOKYO OHKA KOGYO CO., LTD. (JP) 2021-06-01 US disclosed
CN-109082021-B Polymer resin composition and application thereof in high-frequency circuit board 广东生益科技股份有限公司 2021-01-01 CN disclosed
CN-107797384-B Photosensitive resin, positive photoresist and application 上海飞凯电子材料有限公司 2020-10-09 CN disclosed
US-5376498-A Blend of an alkali-soluble resin, compound that generates an acid upon irradiation, functional aromatic compound and a phenolic compound JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1994-12-27 US disclosed
US-5302662-A Polyamides, polyethers, polystyrene, polycarbonates, and polymethyl vinyl ether and compatibilizer comprising styrene-vinylphenol copolymer; mechanical properties EASTMAN KODAK COMPANY (US) 1994-04-12 US disclosed
JP-H0632838-A P-HYDROXYSTYRENE-STYRENE RANDOM COPOLYNMER PARTIALLY ESTERIFIED WITH T-BUTOXYCARBONYL GROUP AND ITS PRODUCTION SHIN ETSU CHEM CO LTD 1994-02-08 JP disclosed
US-5276089-A Polystyrene, polyphenylene oxide blends with polyesters EASTMAN KODAK COMPANY (US) 1994-01-04 US disclosed
EP-0542572-A1 Negative type radiation-sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1993-05-19 EP disclosed
EP-0294109-B1 DYESHEETS IMPERIAL CHEMICAL INDUSTRIES PLC (GB) 1993-03-10 EP disclosed
EP-0530648-A2 Compatible polyester blends EASTMAN CHEMICAL COMPANY (US) 1993-03-10 EP disclosed
US-4920092-A POLYMER BACKBONE BONDED TO A STRUCTURE OF THERMALLY TRANSFER-ABLE DYE MOLECULES IMPERIAL CHEMICAL INDUSTRICES PLC (GB) 1990-04-24 US disclosed
EP-0294109-A2 Dyesheets IMPERIAL CHEMICAL INDUSTRIES PLC (GB) 1988-12-07 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-11022880-B2 Chemically amplified positive-type photosensitive resin composition, photosensitive dry film, method of manufacturing photosensitive dry film, method of manufacturing patterned resist film, method of manufacturing substrate with template, method of manufacturing plated article, and mercapto compound CUTA, POLR1C, ASIC1 APP 1442/4885MAOB 1447/4885MAPT 1711/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.