SCHEMBL304110

SCHEMBL304110

C=C(C)C(=O)OC1CC2CC1CC2C#N

nearest known ligand 0.31

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
▸ ALDH1A1 P00352 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL24687529 1.00 ALDH1A1 (0.31) ALDH1A1
SCHEMBL21505907 1.00 ALDH1A1 (0.31) ALDH1A1
SCHEMBL27209638 0.85 ALDH1A1 (0.41) ALDH1A1
SCHEMBL10180142 0.84 — —
SCHEMBL10181563 0.83 THRB (0.33) ALDH1A1
SCHEMBL75085 0.80 CHRM2 (0.38) ALDH1A1
SCHEMBL18643942 0.80 CHRM2 (0.38) ALDH1A1
SCHEMBL18714190 0.80 CHRM2 (0.38) ALDH1A1
SCHEMBL10180115 0.80 — —
SCHEMBL10065786 0.79 — —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 116 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7122291-B2 Photoresist compositions AZ ELECTRONIC MATERIALS USA CORP. (US) 2006-10-17 — — US claimed
WO-2006013475-A2 PHOTORESIST COMPOSITIONS AZ ELECTRONIC MATERIAL USA CORP. (DE) 2006-02-09 — — WO claimed
US-20060024610-A1 Photosensitivity and reduces edge roughness of the imaged photoresist profiles MERCK PATENT GMBH (DE) 2006-02-02 — — US claimed
US-12032290-B2 Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing electronic device FUJIFILM CORPORATION (JP) 2024-07-09 — — US disclosed
US-20230375925-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, COMPOUND, AND RESIN FUJIFILM CORPORATION (JP) 2023-11-23 — — US disclosed
US-20230375925-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, COMPOUND, AND RESIN FUJIFILM CORPORATION (JP) 2023-11-23 — — US disclosed
US-20230367212-A1 PATTERN FORMING METHOD AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2023-11-16 — — US disclosed
US-20230367210-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2023-11-16 — — US disclosed
US-20230367210-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2023-11-16 — — US disclosed
US-20230367212-A1 PATTERN FORMING METHOD AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2023-11-16 — — US disclosed
US-11697754-B2 Thermal conductive layer, photosensitive layer, photosensitive composition, manufacturing method for thermal conductive layer, and laminate and semiconductor device FUJIFILM CORPORATION (JP) 2023-07-11 — — US disclosed
US-20070098920-A1 Optical film, polarizing plate and liquid crystal display FUJIFILM CORPORATION (JP) 2007-05-03 — — US disclosed
US-20070098920-A1 Optical film, polarizing plate and liquid crystal display FUJIFILM CORPORATION (JP) 2007-05-03 — — US disclosed
US-20070002232-A1 Optical compensation film, polarizing plate and liquid crystal display device FUJI PHOTO FILM CO., LTD. (JP) 2007-01-04 — — US disclosed
US-20070002232-A1 Optical compensation film, polarizing plate and liquid crystal display device FUJI PHOTO FILM CO., LTD. (JP) 2007-01-04 — — US disclosed
US-7122291-B2 Photoresist compositions AZ ELECTRONIC MATERIALS USA CORP. (US) 2006-10-17 — — US disclosed
US-20060127801-A1 Resist polymer and resist composition MITSUBISHI RAYON CO., LTD. (JP) 2006-06-15 — — US disclosed
WO-2006013475-A2 PHOTORESIST COMPOSITIONS AZ ELECTRONIC MATERIAL USA CORP. (DE) 2006-02-09 — — WO disclosed
US-20060024610-A1 Photosensitivity and reduces edge roughness of the imaged photoresist profiles MERCK PATENT GMBH (DE) 2006-02-02 — — US disclosed
US-6165678-A Lithographic photoresist composition and process for its use in the manufacture of integrated circuits INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2000-12-26 — — US disclosed
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