SCHEMBL30416809

SCHEMBL30416809

C[C@H](NC(=O)CN)C(=O)N[C@@H](CO)C(=O)N[C@@H](Cc1ccc(O)cc1)C(=O)O

nearest known ligand 0.53

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
ACE P12821 10/20 0.53
MME P08473 9/20 0.53
CPA1 P15085 2/20 0.53
ACE2 Q9BYF1 2/20 0.53
FOLH1 Q04609 1/20 0.51

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29349965 0.94 ACE (0.58) ACEMMECPA1ACE2FOLH1
SCHEMBL30417283 0.94 OPRD1 (0.55) ACEMMECPA1ACE2
SCHEMBL30417716 0.94 OPRD1 (0.55) ACEMMECPA1ACE2
SCHEMBL30440289 0.93 OPRD1 (0.56) ACEMMECPA1ACE2
SCHEMBL29644411 0.90 MME (0.52) ACEMMECPA1ACE2FOLH1
SCHEMBL30439626 0.89 OPRD1 (0.49)
SCHEMBL30417372 0.88 OPRD1 (0.50)
SCHEMBL29603412 0.87 OPRD1 (0.60) ACEMMECPA1ACE2
SCHEMBL30367266 0.87 ENPEP (0.52) ACEMMECPA1ACE2FOLH1
SCHEMBL29822475 0.85 MME (0.56) ACEMMECPA1ACE2FOLH1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230176480-A1 POLYPEPTIDE, PHOTORESIST COMPOSITION INCLUDING THE SAME, AND METHOD OF FORMING PATTERN USING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2023-06-08 US claimed
EP-4191335-A1 POLYPEPTIDE, PHOTORESIST COMPOSITION INCLUDING THE SAME, AND METHOD OF FORMING PATTERN USING THE SAME Samsung Electronics Co., Ltd. (KR) 2023-06-07 EP claimed
CN-116217673-A Polypeptides, photoresist compositions comprising the same, and methods of forming patterns using the same 三星电子株式会社 2023-06-06 CN claimed
US-20250155807-A1 POLYPEPTIDE, PHOTORESIST COMPOSITION INCLUDING THE SAME, AND METHOD OF FORMING PATTERN USING THE SAME SAMSUNG ELECTRONICS CO LTD (KR) 2025-05-15 US disclosed
US-20230176480-A1 POLYPEPTIDE, PHOTORESIST COMPOSITION INCLUDING THE SAME, AND METHOD OF FORMING PATTERN USING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2023-06-08 US disclosed
EP-4191335-A1 POLYPEPTIDE, PHOTORESIST COMPOSITION INCLUDING THE SAME, AND METHOD OF FORMING PATTERN USING THE SAME Samsung Electronics Co., Ltd. (KR) 2023-06-07 EP disclosed
CN-116217673-A Polypeptides, photoresist compositions comprising the same, and methods of forming patterns using the same 三星电子株式会社 2023-06-06 CN disclosed