SCHEMBL30457399

SCHEMBL30457399

CCCCC(C)(C)OOOC(=O)OCCC

nearest known ligand 0.37

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.33
ATM Q13315 2/20 0.32
NAAA Q02083 1/20 0.31
DGKA P23743 1/20 0.31
MEN1 O00255 1/20 0.30
MAPT P10636 1/20 0.30
KMT2A Q03164 1/20 0.30
L3MBTL1 Q9Y468 1/20 0.30
HPGD P15428 1/20 0.30
TSHR P16473 1/20 0.30
ACHE P22303 1/20 0.30
HCAR2 Q8TDS4 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30457039 0.93 ALDH1A1 (0.41) ALDH1A1ATMNAAAL3MBTL1HPGD
SCHEMBL30457075 0.90 LMNA (0.34) ALDH1A1HCAR2
SCHEMBL30595886 0.88 ALDH1A1 (0.40) ALDH1A1ATMMEN1MAPTKMT2A
SCHEMBL12004773 0.87 ALDH1A1 (0.41) ALDH1A1ATMNAAAL3MBTL1HPGD
SCHEMBL11514705 0.85 ATM (0.37) ALDH1A1ATMNAAADGKAMEN1
SCHEMBL30457292 0.84 HCAR2 (0.32) ALDH1A1TSHRHCAR2
SCHEMBL30877066 0.83 TSHR (0.32) MAPTL3MBTL1TSHR
SCHEMBL29280149 0.81 ALDH1A1 (0.42) ALDH1A1ATMNAAAL3MBTL1HPGD
SCHEMBL30457370 0.81 HDAC1 (0.32)
SCHEMBL30456994 0.81 HCAR2 (0.31) ALDH1A1HCAR2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025075118-A1 THERMOPLASTIC RESIN COMPOSITION AND USE THEREOF 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075123-A1 THERMOPLASTIC RESIN COMPOSITION 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075121-A1 CROSS-LINKED RESIN PARTICLES AND METHOD FOR PRODUCING SAME 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075152-A1 GRANULAR BODY, METHOD FOR PRODUCING SAME, AND THERMOPLASTIC RESIN COMPOSITION 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075122-A1 CROSSLINKED RESIN PARTICLES AND THERMOPLASTIC RESIN MODIFIER 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075124-A1 MOLDED FILM OR MOLDED SHEET 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075120-A1 THERMOPLASTIC RESIN COMPOSITION 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075117-A1 THERMOPLASTIC RESIN COMPOSITION AND USE THEREOF 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075125-A1 BLOW-MOLDED ARTICLE AND METHOD FOR PRODUCING SAME 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075116-A1 THERMOPLASTIC RESIN COMPOSITION AND USE THEREOF 株式会社カネカ 2025-04-10 WO disclosed
WO-2024203745-A1 RESIN POWDER AND METHOD FOR PRODUCING SAME 株式会社カネカ 2024-10-03 WO disclosed
WO-2024090484-A1 THERMOPLASTIC RESIN COMPOSITION 株式会社カネカ 2024-05-02 WO disclosed
US-20230323114-A1 ALIPHATIC-POLYESTER-BASED RESIN COMPOSITION AND UTILIZATION THEREOF KANEKA CORPORATION (JP) 2023-10-12 US disclosed
WO-2023190185-A1 THERMOPLASTIC RESIN COMPOSITION 株式会社カネカ 2023-10-05 WO disclosed
WO-2023190184-A1 THERMOPLASTIC RESIN COMPOSITION 株式会社カネカ 2023-10-05 WO disclosed
WO-2023190183-A1 CROSSLINKED RESIN PARTICLES AND METHOD FOR PRODUCING SAME 株式会社カネカ 2023-10-05 WO disclosed
EP-4183828-A1 ALIPHATIC-POLYESTER-BASED RESIN COMPOSITION AND UTILIZATION THEREOF Kaneka Corporation (JP) 2023-05-24 EP disclosed