SCHEMBL30457075

SCHEMBL30457075

CCCOC(=O)OOOC(C)(C)CCC

nearest known ligand 0.34

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
LMNA P02545 2/20 0.34
HSD17B10 Q99714 1/20 0.34
HCAR2 Q8TDS4 1/20 0.32
ALDH1A1 P00352 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12004773 0.90 ALDH1A1 (0.41) LMNAHSD17B10HCAR2ALDH1A1
SCHEMBL30457399 0.90 ALDH1A1 (0.33) HCAR2ALDH1A1
SCHEMBL30457292 0.87 HCAR2 (0.32) LMNAHCAR2ALDH1A1
SCHEMBL30456994 0.84 HCAR2 (0.31) HCAR2ALDH1A1
Bicarbonate SCHEMBL26113508 0.84 HCAR2 (0.34) LMNAHCAR2ALDH1A1
SCHEMBL6927551 0.83 HCAR2 (0.38) LMNAHSD17B10HCAR2ALDH1A1
SCHEMBL986161 0.83 HCAR2 (0.34) LMNAHCAR2ALDH1A1
SCHEMBL9719578 0.83 TSHR (0.46) HSD17B10ALDH1A1
SCHEMBL10349936 0.83 THRB (0.45) ALDH1A1
SCHEMBL30457039 0.83 ALDH1A1 (0.41) LMNAHCAR2ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025075120-A1 THERMOPLASTIC RESIN COMPOSITION 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075152-A1 GRANULAR BODY, METHOD FOR PRODUCING SAME, AND THERMOPLASTIC RESIN COMPOSITION 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075123-A1 THERMOPLASTIC RESIN COMPOSITION 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075122-A1 CROSSLINKED RESIN PARTICLES AND THERMOPLASTIC RESIN MODIFIER 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075121-A1 CROSS-LINKED RESIN PARTICLES AND METHOD FOR PRODUCING SAME 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075118-A1 THERMOPLASTIC RESIN COMPOSITION AND USE THEREOF 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075124-A1 MOLDED FILM OR MOLDED SHEET 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075117-A1 THERMOPLASTIC RESIN COMPOSITION AND USE THEREOF 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075125-A1 BLOW-MOLDED ARTICLE AND METHOD FOR PRODUCING SAME 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075116-A1 THERMOPLASTIC RESIN COMPOSITION AND USE THEREOF 株式会社カネカ 2025-04-10 WO disclosed
WO-2024203745-A1 RESIN POWDER AND METHOD FOR PRODUCING SAME 株式会社カネカ 2024-10-03 WO disclosed
WO-2024090484-A1 THERMOPLASTIC RESIN COMPOSITION 株式会社カネカ 2024-05-02 WO disclosed
US-20230323114-A1 ALIPHATIC-POLYESTER-BASED RESIN COMPOSITION AND UTILIZATION THEREOF KANEKA CORPORATION (JP) 2023-10-12 US disclosed
WO-2023190183-A1 CROSSLINKED RESIN PARTICLES AND METHOD FOR PRODUCING SAME 株式会社カネカ 2023-10-05 WO disclosed
WO-2023190184-A1 THERMOPLASTIC RESIN COMPOSITION 株式会社カネカ 2023-10-05 WO disclosed
WO-2023190185-A1 THERMOPLASTIC RESIN COMPOSITION 株式会社カネカ 2023-10-05 WO disclosed
EP-4183828-A1 ALIPHATIC-POLYESTER-BASED RESIN COMPOSITION AND UTILIZATION THEREOF Kaneka Corporation (JP) 2023-05-24 EP disclosed