SCHEMBL30469477

SCHEMBL30469477

Nc1ccc(Oc2ccc(F)cc2)c(N)c1

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 6/20 0.50
MEN1 O00255 4/20 0.50
KMT2A Q03164 4/20 0.50
ALDH1A1 P00352 4/20 0.50
KDM4E B2RXH2 3/20 0.50
CYP1A2 P05177 2/20 0.50
CYP2C9 P11712 2/20 0.50
CYP2C19 P33261 2/20 0.50
SMN1; SMN2 Q16637 2/20 0.50
CYP2D6 P10635 1/20 0.50
HPGD P15428 1/20 0.50
MAPK1 P28482 1/20 0.48
L3MBTL1 Q9Y468 2/20 0.46
RAB9A P51151 1/20 0.46
CACNA1C Q13936 1/20 0.46
CYP3A4 P08684 2/20 0.44
ATM Q13315 2/20 0.43
LMNA P02545 2/20 0.43
TSHR P16473 1/20 0.43
TDP1 Q9NUW8 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3193820 1.00 MAPT (0.50) MAPTMEN1KMT2AALDH1A1KDM4E
SCHEMBL7028593 0.95 MAPT (0.46) MAPTMEN1KMT2AALDH1A1KDM4E
SCHEMBL7806773 0.90 MAPT (0.59) MAPTMEN1KMT2AALDH1A1KDM4E
SCHEMBL1339195 0.88 MAPT (0.53) MAPTMEN1KMT2AALDH1A1KDM4E
SCHEMBL30744926 0.88 MAPT (0.57) MAPTMEN1KMT2AALDH1A1KDM4E
SCHEMBL362820 0.88 MAPT (0.57) MAPTMEN1KMT2AALDH1A1KDM4E
SCHEMBL21186231 0.86 MEN1 (0.49) MAPTMEN1KMT2AALDH1A1KDM4E
SCHEMBL3024118 0.85 HSPB1 (0.50) MAPTMEN1KMT2AALDH1A1KDM4E
SCHEMBL31287801 0.85 HSPB1 (0.50) MAPTMEN1KMT2AALDH1A1KDM4E
SCHEMBL28806097 0.84 MAPT (0.53) MAPTMEN1KMT2AALDH1A1KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117202984-A Polyimide porous film 东京应化工业株式会社 2023-12-08 CN disclosed
CN-116891570-A Polyamic acid, polyimide, metal-clad laminate, and circuit board 日铁化学材料株式会社 2023-10-17 CN disclosed
CN-113874420-B Resin film and metal-clad laminate 日铁化学材料株式会社 2023-09-26 CN disclosed
CN-116367413-A Metal-clad laminate and circuit board 日铁化学材料株式会社 2023-06-30 CN disclosed
CN-116353168-A Resin laminate, circuit board, electronic component, and electronic device 日铁化学材料株式会社 2023-06-30 CN disclosed