SCHEMBL30496909

SCHEMBL30496909

CCN(CCCS(=O)(=O)O)c1ccc(N=O)c(O)c1.O=NN(O)c1cccc2ccccc12

nearest known ligand 0.37

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HIF1A Q16665 2/20 0.37
MAPT P10636 12/20 0.37
ALDH1A1 P00352 10/20 0.37
GAA P10253 4/20 0.37
NPSR1 Q6W5P4 2/20 0.37
KCNH2 Q12809 1/20 0.35
RAB9A P51151 3/20 0.34
NPC1 O15118 3/20 0.34
KDM4E B2RXH2 8/20 0.34
HTT P42858 4/20 0.33
MAPK1 P28482 2/20 0.33
MEN1 O00255 8/20 0.33
KMT2A Q03164 8/20 0.33
LMNA P02545 6/20 0.33
SMN1; SMN2 Q16637 4/20 0.33
L3MBTL1 Q9Y468 2/20 0.33
HPGD P15428 4/20 0.32
GRK6 P43250 1/20 0.32
ALOX12 P18054 1/20 0.32
SIGMAR1 Q99720 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29406852 0.83 MAPT (0.42) MAPTALDH1A1GAANPSR1KCNH2
SCHEMBL2904153 0.83 MAPT (0.42) MAPTALDH1A1GAANPSR1KCNH2
Hydrochloric Acid SCHEMBL11220426 0.82 MAPT (0.41) MAPTALDH1A1GAANPSR1KCNH2
SCHEMBL2266611 0.76 KCNH2 (0.40) MAPTALDH1A1GAANPSR1KCNH2
SCHEMBL29606616 0.76 KCNH2 (0.40) MAPTALDH1A1GAANPSR1KCNH2
SCHEMBL28222325 0.70 ALDH1A1 (0.33) MAPTALDH1A1GAAKCNH2RAB9A
SCHEMBL27822003 0.69 MAPT (0.41) MAPTALDH1A1GAANPSR1RAB9A
SCHEMBL29203833 0.69 MAPT (0.45) MAPTALDH1A1GAANPSR1RAB9A
SCHEMBL374911 0.68 MAPT (0.53) MAPTALDH1A1GAANPSR1RAB9A
SCHEMBL29740108 0.68 MAPT (0.53) MAPTALDH1A1GAANPSR1RAB9A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117378044-A Polyimide-containing part forming composition, method for producing bonded body, method for producing device, and device 富士胶片株式会社 2024-01-09 CN disclosed
CN-117203746-A Method for manufacturing bonded body, method for manufacturing semiconductor device, and resin composition 富士胶片株式会社 2023-12-08 CN disclosed
CN-116724071-A Resin composition, cured product, laminate, method for producing cured product, and semiconductor device 富士胶片株式会社 2023-09-08 CN disclosed
CN-116685622-A Resin composition, cured product, laminate, method for producing cured product, and semiconductor device 富士胶片株式会社 2023-09-01 CN disclosed
CN-116648313-A Resin composition, cured product, laminate, method for producing cured product, and semiconductor device 富士胶片株式会社 2023-08-25 CN disclosed