SCHEMBL304983

SCHEMBL304983

CO[Si](C)([O])OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL295942 0.76
SCHEMBL10402330 0.70
SCHEMBL9628899 0.70
SCHEMBL125396 0.67
SCHEMBL28152 0.64
SCHEMBL4389530 0.61
SCHEMBL15341 0.61
SCHEMBL403200 0.61
SCHEMBL35033 0.60
SCHEMBL479251 0.60

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 418 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4279560-A1 AQUEOUS AMINOSILOXANE HARDENERS FOR ADHESIVE MASSES, CORRESPONDING MASSES AND USES AND METHODS RELATED THERETO fischerwerke GmbH & Co. KG (DE) 2023-11-22 EP claimed
EP-2998376-B1 THERMALLY CONDUCTIVE SILICONE ADHESIVE COMPOSITION FOR REACTOR AND REACTOR SHINETSU CHEMICAL CO (JP) 2018-03-28 EP claimed
US-9424977-B2 Thermally conductive silicone adhesive composition for reactor and reactor SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-08-23 US claimed
US-20160086713-A1 THERMALLY CONDUCTIVE SILICONE ADHESIVE COMPOSITION FOR REACTOR AND REACTOR TOYOTA JIDOSHA KABUSHIKI KAISHA (JP) 2016-03-24 US claimed
EP-2998376-A1 THERMALLY CONDUCTIVE SILICONE ADHESIVE COMPOSITION FOR REACTOR AND REACTOR Shin-Etsu Chemical Co., Ltd. (JP) 2016-03-23 EP claimed
US-8361622-B2 Highly disperse metal oxides having a high positive surface charge WACKER CHEMIE AG (DE) 2013-01-29 US claimed
EP-1523511-B1 PRIMER WITH LONG CURE TIME FOR POLYMERIC SUBSTRATES SIKA TECHNOLOGY AG (CH) 2011-06-08 EP claimed
US-7507443-B2 Primer with long open time for polymeric substrates SIKA TECHNOLOGY AG (CH) 2009-03-24 US claimed
EP-1388572-B1 Addition reaction curable organopolysiloxane composition SHINETSU CHEMICAL CO (JP) 2007-10-03 EP claimed
US-20060167190-A1 Primer with long cure time for polymeric substrates SIKA TECHNOLOGY AG (CH) 2006-07-27 US claimed
EP-0050453-B1 AN OIL-RESISTANT GASKET MATERIAL AND PACKING MATERIAL Toray Silicone Company Limited (JP) 1985-04-24 EP claimed
US-4513115-A ROOM TEMPERATURE VULCANIZABLE POLYALKOXY-TERMINATED POLYSILOXANE AND HYDROLIZABLE SCAVENGER, SHELF LIFE GENERAL ELECTRIC COMPANY (US) 1985-04-23 US claimed
EP-0104179-A4 SCAVENGERS FOR ONE-COMPONENT ALKOXY-FUNCTIONAL RTV COMPOSITIONS AND PROCESSES. GEN ELECTRIC (US) 1984-07-24 EP claimed
EP-0104179-A1 SCAVENGERS FOR ONE-COMPONENT ALKOXY-FUNCTIONAL RTV COMPOSITIONS AND PROCESSES. GEN ELECTRIC (US) 1984-04-04 EP claimed
US-4417042-A Scavengers for one-component alkoxy-functional RTV compositions and processes GENERAL ELECTRIC COMPANY (US) 1983-11-22 US claimed
WO-1983002948-A1 SCAVENGERS FOR ONE-COMPONENT ALKOXY-FUNCTIONAL RTV COMPOSITIONS AND PROCESSES GEN ELECTRIC (US) 1983-09-01 WO claimed
US-4395526-A SILANE SCAVENGER GENERAL ELECTRIC COMPANY (US) 1983-07-26 US claimed
WO-1983000156-A1 ONE PACKAGE, STABLE, MOISTURE CURABLE, POLYALKOXY-TERMINATED ORGANOPOLYSILOXANE COMPOSITIONS AND METHOD FOR MAKING GEN ELECTRIC (US) 1983-01-20 WO claimed
EP-0069256-A2 One package, stable, moisture curable, polyalkoxy-terminated organopolysiloxane compositions and method for making GENERAL ELECTRIC COMPANY (US) 1983-01-12 EP claimed
EP-0050453-A1 An oil-resistant gasket material and packing material Toray Silicone Company Limited (JP) 1982-04-28 EP claimed