⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL305668 | 0.87 | — | — | |
| SCHEMBL5474854 | 0.87 | — | — | |
| SCHEMBL3171641 | 0.87 | — | — | |
| SCHEMBL176364 | 0.82 | — | — | |
| SCHEMBL862074 | 0.82 | — | — | |
| SCHEMBL5807068 | 0.82 | — | — | |
| SCHEMBL5015927 | 0.78 | — | — | |
| SCHEMBL277963 | 0.67 | — | — | |
| SCHEMBL3785876 | 0.67 | — | — | |
| SCHEMBL2207175 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-100408202-C | Electroless plating solution and process | MATTSON TECH INC (US) | 2008-08-06 | — | — | CN | claimed |
| CN-1761534-A | Electroless plating solution and method | MATTSON TECH INC (US) | 2006-04-19 | — | — | CN | claimed |
| US-6797312-B2 | DOES NOT REQUIRE THE USE OF A CATALYST, COMPRISING A FIRST REDUCING AGENT, A SECOND REDUCING AGENT, A PH ADJUSTING AGENT, A FIRST METAL SOURCE, AND A SECOND METAL SOURCE | MATTSON TECHNOLOGY, INC. | 2004-09-28 | — | — | US | claimed |
| WO-2004067192-A1 | ELECTROLESS PLATING SOLUTION AND PROCESS | MATTSON TECHNOLOGY, INC. (US) | 2004-08-12 | — | — | WO | claimed |
| US-20040142114-A1 | Electroless plating solution and process | MATTSON TECHNOLOGY, INC. | 2004-07-22 | — | — | US | claimed |
| CN-111778531-B | Wear-resistant composite plating solution for increasing excessive steel amount of crystallizer copper pipe | 济南东方结晶器有限公司 | 2022-07-08 | — | — | CN | disclosed |
| CN-111778531-B | Wear-resistant composite plating solution for increasing excessive steel amount of crystallizer copper pipe | 济南东方结晶器有限公司 | 2022-07-08 | — | — | CN | disclosed |
| US-8709906-B2 | MIM capacitor and associated production method | INFINEON TECHNOLOGIES AG (DE) | 2014-04-29 | — | — | US | disclosed |
| US-20120100689-A1 | MIM CAPACITOR AND ASSOCIATED PRODUCTION METHOD | INFINEON TECHNOLOGIES AG (DE) | 2012-04-26 | — | — | US | disclosed |
| US-8093637-B2 | MIM capacitor and associated production method | INFINEON TECHNOLOGIES AG (DE) | 2012-01-10 | — | — | US | disclosed |
| US-20100022083-A1 | CARBON NANOTUBE INTERCONNECT STRUCTURES | INTEL CORPORATION (US) | 2010-01-28 | — | — | US | disclosed |
| US-7625817-B2 | Method of fabricating a carbon nanotube interconnect structures | INTEL CORPORATION (US) | 2009-12-01 | — | — | US | disclosed |
| WO-2007130731-A2 | BARRIER FOR USE IN 3-D INTEGRATION OF CIRCUITS | FREESCALE SEMICONDUCTOR INC. (US) | 2007-11-15 | — | — | WO | disclosed |
| US-20070231950-A1 | BARRIER FOR USE IN 3-D INTEGRATION OF CIRCUITS | NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC. (NL) | 2007-10-04 | — | — | US | disclosed |
| US-20070155158-A1 | Carbon nanotube interconnect structures | INTEL CORPORATION | 2007-07-05 | — | — | US | disclosed |
| US-20070111431-A1 | MIM capacitor and associated production method | INFINEON TECHNOLOGIES AG (DE) | 2007-05-17 | — | — | US | disclosed |
| CN-1761534-A | Electroless plating solution and method | MATTSON TECH INC (US) | 2006-04-19 | — | — | CN | disclosed |
| US-6797312-B2 | DOES NOT REQUIRE THE USE OF A CATALYST, COMPRISING A FIRST REDUCING AGENT, A SECOND REDUCING AGENT, A PH ADJUSTING AGENT, A FIRST METAL SOURCE, AND A SECOND METAL SOURCE | MATTSON TECHNOLOGY, INC. | 2004-09-28 | — | — | US | disclosed |
| WO-2004067192-A1 | ELECTROLESS PLATING SOLUTION AND PROCESS | MATTSON TECHNOLOGY, INC. (US) | 2004-08-12 | — | — | WO | disclosed |
| US-20040142114-A1 | Electroless plating solution and process | MATTSON TECHNOLOGY, INC. | 2004-07-22 | — | — | US | disclosed |