SCHEMBL30880452

SCHEMBL30880452

O=c1oc2c3ccccc3c(=O)oc2c2ccccc12

nearest known ligand 0.57

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR2 Q92731 1/20 0.57
ELANE P08246 4/20 0.54
SMN1; SMN2 Q16637 3/20 0.54
ALDH1A1 P00352 3/20 0.54
NPSR1 Q6W5P4 2/20 0.54
MAPT P10636 2/20 0.54
HSD17B10 Q99714 2/20 0.54
CYP1A2 P05177 2/20 0.54
CYP2D6 P10635 2/20 0.54
CYP2C9 P11712 2/20 0.54
CYP2C19 P33261 2/20 0.54
GMNN O75496 1/20 0.54
LMNA P02545 1/20 0.54
TP53 P04637 1/20 0.54
POLB P06746 1/20 0.54
CTSG P08311 1/20 0.54
CTSA P10619 1/20 0.54
ALOX15 P16050 1/20 0.54
NFKB1 P19838 1/20 0.54
THPO P40225 1/20 0.54

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL24891350 0.85 ELANE (0.61) ESR2ELANESMN1; SMN2ALDH1A1NPSR1
SCHEMBL27332096 0.83 MAOA (0.57) ESR2SMN1; SMN2ALDH1A1MAPTHSD17B10
SCHEMBL257 0.82 ALDH1A1 (0.58) ESR2ELANESMN1; SMN2ALDH1A1NPSR1
SCHEMBL29391754 0.82 ALDH1A1 (0.58) ESR2ELANESMN1; SMN2ALDH1A1NPSR1
SCHEMBL30966887 0.82 ALDH1A1 (0.58) ESR2ELANESMN1; SMN2ALDH1A1NPSR1
SCHEMBL16925885 0.80 ESR2 (0.50) ESR2ELANESMN1; SMN2ALDH1A1NPSR1
SCHEMBL21249171 0.80 ESR2 (0.50) ESR2ELANESMN1; SMN2ALDH1A1NPSR1
SCHEMBL26779869 0.80 ESR2 (0.64) ESR2NPSR1CYP1A2CYP2D6CYP2C9
SCHEMBL3081576 0.80 ARSA (0.56) ESR2SMN1; SMN2ALDH1A1MAPTHSD17B10
SCHEMBL17384169 0.80 HPRT1 (0.56) ESR2ALDH1A1MAPTHSD17B10CYP1A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024090264-A1 NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING HOLLOW STRUCTURE, AND METHOD FOR FORMING PATTERN 東京応化工業株式会社 2024-05-02 WO disclosed