SCHEMBL308952

SCHEMBL308952

CC(=CCC1CCC2OC2C1)C(=O)O

nearest known ligand 0.34

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
CD81 P60033 1/20 0.33
KDM4E B2RXH2 1/20 0.33
GMNN O75496 1/20 0.33
LMNA P02545 1/20 0.33
PMP22 Q01453 1/20 0.33
TFPI2 P48307 1/20 0.33
TP53 P04637 1/20 0.33
TSHR P16473 1/20 0.33
NFKB1 P19838 1/20 0.33
THPO P40225 1/20 0.33
ICAM1 P05362 1/20 0.31
PPM1B O75688 2/20 0.31
PTPN1 P18031 2/20 0.31
PPP1CC P36873 2/20 0.31
TBXA2R P21731 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7713682 0.89
SCHEMBL30436867 0.86 ALDH1A1 (0.40) TSHR
SCHEMBL8849394 0.86 ALOX5 (0.30)
SCHEMBL8849391 0.86 ALOX5 (0.30)
SCHEMBL2019678 0.84 CD81 (0.38) CD81KDM4EGMNNLMNAPMP22
SCHEMBL53621 0.84 CD81 (0.38) CD81KDM4EGMNNLMNAPMP22
SCHEMBL30915479 0.84 ALDH1A1 (0.30)
SCHEMBL20787025 0.83 PPM1B (0.34) PPM1BPTPN1PPP1CC
SCHEMBL2503576 0.80 CD81 (0.38) CD81LMNATSHRICAM1
SCHEMBL28929943 0.79 TFPI2 (0.32) KDM4EGMNNLMNAPMP22TFPI2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 300 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240243395-A1 BATTERY WITH COATING AND PREPARATION METHOD THEREFOR JIANGSU FAVORED NANOTECHNOLOGY CO., LTD. (CN) 2024-07-18 US claimed
US-20240158645-A1 COMPOSITE COATING, PREPARATION METHOD, AND DEVICE JIANGSU FAVORED NANOTECHNOLOGY CO., LTD. (CN) 2024-05-16 US claimed
EP-4303272-A1 COMPOSITE COATING, PREPARATION METHOD, AND DEVICE Jiangsu Favored Nanotechnology Co., Ltd. (CN) 2024-01-10 EP claimed
CN-111423574-B Dispersant for polymer polyol having cyclohexane structure and preparation method thereof 淮安巴德聚氨酯科技有限公司 2023-01-10 CN claimed
CN-114773905-A White UV/thermal dual-curing FPC inkjet character ink and preparation method thereof 华南理工大学 2022-07-22 CN claimed
CN-114774049-A Epoxy glue for miniLED and preparation method thereof 厦门优佰电子材料有限公司 2022-07-22 CN claimed
CN-114634613-A Color 3D printing material and application thereof 北京印刷学院 2022-06-17 CN claimed
CN-114517071-A Formula and preparation method of low-viscosity ultraviolet photo-thermal dual-curing optical fiber ring pouring sealant 尚宁智感(北京)科技有限公司 2022-05-20 CN claimed
CN-113956710-A Cationic UV (ultraviolet) curing type glass ink, product produced by adopting cationic UV curing type glass ink and production process 杭州科望特种油墨有限公司 2022-01-21 CN claimed
CN-113956709-A Magnetic UV (ultraviolet) curing printing ink 杭州科望特种油墨有限公司 2022-01-21 CN claimed
EP-1990819-A2 Hybrid composite including carbon nanotube and carbide-derived carbon, electron emitter including the hybrid composite, method of preparing the electron emitter, and electron emission device including the electron emitter Samsung SDI Co., Ltd. (KR) 2008-11-12 EP claimed
US-20080238318-A1 PHOTOSENSITIVE PASTE COMPOSITION, BARRIER RIB PREPARED USING THE COMPOSITION AND PLASMA DISPLAY PANEL COMPRISING THE BARRIER RIB SAMSUNG SDI CO., LTD. (KR) 2008-10-02 US claimed
US-20080227033-A1 Photosensitive Paste Composition, Plasma Display Panel Manufactured Using the Same and Method of Manufacturing the Plasma Display Panel SAMSUNG SDI CO., LTD. (KR) 2008-09-18 US claimed
US-20080220368-A1 PHOTOSENSITIVE PASTE COMPOSITION, BARRIER RIB PREPARED USING THE COMPOSITION AND PLASMA DISPLAY PANEL COMPRISING THE BARRIER RIB SAMSUNG SDI CO., LTD. (KR) 2008-09-11 US claimed
US-20060166113-A1 Photosensitive paste composition and plasma display panel manufactured using the same SAMSUNG SDI CO., LTD. (KR) 2006-07-27 US claimed
US-20060164011-A1 Photosensitive paste composition, PDP electrode manufactured using the composition, and PDP including the PDP electrode SAMSUNG SDI CO., LTD., A CORPORATION OF THE REPUBLIC OF KOREA (KR) 2006-07-27 US claimed
US-20050271979-A1 Photosensitive paste composition, PDP electrode prepared therefrom, and PDP comprising the PDP electrode SAMSUNG SDI CO., LTD. (KR) 2005-12-08 US claimed
EP-1027190-B1 COATED ABRASIVE PRODUCTS UCB SA (BE) 2003-07-23 EP claimed
EP-0713144-B1 Photosensitive resin composition HOECHST JAPAN (JP) 1998-09-23 EP claimed
EP-0422647-B1 Dispersion of fine particles of a polymer KANSAI PAINT CO LTD (JP) 1994-12-28 EP claimed