SCHEMBL30909302

SCHEMBL30909302

CC(C)(C)c1ccccc1OP(O)OP(O)O

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NAMPT P43490 1/20 0.42
ALDH1A1 P00352 5/20 0.42
KDM4E B2RXH2 4/20 0.42
GAA P10253 2/20 0.42
TDP1 Q9NUW8 3/20 0.41
ATM Q13315 1/20 0.41
MAPT P10636 2/20 0.41
P2RY1 P47900 4/20 0.41
TSHR P16473 1/20 0.41
NPSR1 Q6W5P4 1/20 0.39
TP53 P04637 1/20 0.39
RXRA P19793 1/20 0.39
RXRB P28702 1/20 0.39
RXRG P48443 1/20 0.39
P2RY14 Q15391 1/20 0.39
MAPK1 P28482 1/20 0.38
HTT P42858 1/20 0.38
CA2 P00918 1/20 0.38
RBP4 P02753 1/20 0.38
CYP1A2 P05177 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11254545 0.90 ALDH1A1 (0.45) NAMPTALDH1A1KDM4EGAATDP1
SCHEMBL29746338 0.89 TDP1 (0.40) NAMPTALDH1A1KDM4EGAATDP1
SCHEMBL5009501 0.86 ALDH1A1 (0.45) NAMPTALDH1A1KDM4EGAATDP1
SCHEMBL29623802 0.86 ALDH1A1 (0.45) NAMPTALDH1A1KDM4EGAATDP1
SCHEMBL30675344 0.86 ALDH1A1 (0.45) NAMPTALDH1A1KDM4EGAATDP1
SCHEMBL30082448 0.85 TDP1 (0.41) NAMPTALDH1A1KDM4EGAATDP1
SCHEMBL27753476 0.84 RXRA (0.41) NAMPTALDH1A1KDM4EGAATDP1
SCHEMBL28473748 0.84 TDP1 (0.41) NAMPTALDH1A1KDM4EGAATDP1
SCHEMBL9491543 0.82 TDP1 (0.43) NAMPTALDH1A1KDM4EGAATDP1
SCHEMBL28552347 0.81 TDP1 (0.42) NAMPTALDH1A1KDM4EGAATDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118055972-B Resin composition for heat-dissipating gap filler, and article 东京油墨株式会社 2024-11-19 CN disclosed
CN-118055972-A Resin composition for heat-dissipating gap filler, and article 东京油墨株式会社 2024-05-17 CN disclosed