SCHEMBL3093708

SCHEMBL3093708

C(OCC1CO1)C1CO1.OCC1CCCO1

nearest known ligand 0.47

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.47
LMNA P02545 2/20 0.42
POLB P06746 1/20 0.42
SMN1; SMN2 Q16637 3/20 0.41
ALDH1A1 P00352 3/20 0.40
TDP1 Q9NUW8 1/20 0.39
MAPK1 P28482 1/20 0.38
TP53 P04637 2/20 0.38
CYP3A4 P08684 1/20 0.38
MEN1 O00255 1/20 0.37
KMT2A Q03164 1/20 0.37
USP2 O75604 1/20 0.35
PDK1 Q15118 2/20 0.35
HPGD P15428 2/20 0.34
ALOX12 P18054 1/20 0.34
ANPEP P15144 1/20 0.34
NPC1 O15118 1/20 0.34
RAB9A P51151 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL594011 0.88 TSHR (0.54) TSHRLMNAPOLBSMN1; SMN2ALDH1A1
Alcohol SCHEMBL3093695 0.87 SMN1; SMN2 (0.48) TSHRLMNAPOLBSMN1; SMN2ALDH1A1
SCHEMBL282891 0.83
SCHEMBL5364993 0.83 LMNA (0.44) TSHRLMNAPOLBSMN1; SMN2ALDH1A1
SCHEMBL282885 0.83
SCHEMBL4208 0.83
Ethylene Glycol SCHEMBL11791402 0.82 LMNA (0.50) TSHRLMNAPOLBSMN1; SMN2ALDH1A1
SCHEMBL27809443 0.81 PDK1 (0.47) LMNAPOLBSMN1; SMN2ALDH1A1TDP1
SCHEMBL23701645 0.81
SCHEMBL2592649 0.81

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116987233-A Cationic UV (ultraviolet) heat curing composition and preparation method thereof 上海汉司实业有限公司 2023-11-03 CN claimed
CN-110582540-B Photocurable epoxy composition 汉高股份有限及两合公司 2022-11-22 CN claimed
CN-110582540-A Photocurable epoxy composition 汉高股份有限及两合公司 2019-12-17 CN claimed
WO-2018184151-A1 Light cure epoxy composition HENKEL AG & CO. KGAA (DE) 2018-10-11 WO claimed
CN-116987233-A Cationic UV (ultraviolet) heat curing composition and preparation method thereof 上海汉司实业有限公司 2023-11-03 CN disclosed
CN-110582540-B Photocurable epoxy composition 汉高股份有限及两合公司 2022-11-22 CN disclosed
CN-110582540-A Photocurable epoxy composition 汉高股份有限及两合公司 2019-12-17 CN disclosed
WO-2018184151-A1 Light cure epoxy composition HENKEL AG & CO. KGAA (DE) 2018-10-11 WO disclosed
EP-2640765-B1 ONE COMPONENT EPOXY RESIN COMPOSITION Henkel IP & Holding GmbH (DE) 2017-01-04 EP disclosed
CN-102550135-B Method for connecting electrodes and adhesive composition used therefor HENKEL CORP 2015-06-17 CN disclosed
CN-103333329-B Method for preparing polycarbonate by copolymerizing carbon dioxide and alpha-pinene derivatives UNIV KUNMING SCIENCE & TECHNOLOGY 2015-06-03 CN disclosed
EP-2867270-A1 WATER-BASED EPOXY RESIN EMULSION Henkel AG & Co. KGaA (DE) 2015-05-06 EP disclosed
US-7795744-B2 Cationically curable epoxy resin composition HENKEL CORPORATION (US) 2010-09-14 US disclosed
CN-101676315-A Sealant for liquid crystal instillation technique and method for manufacturing liquid crystal dispaly HENKEL CORP 2010-03-24 CN disclosed
CN-101553545-A Bonding method and adhesive resin composition HENKEL CORP (US) 2009-10-07 CN disclosed
US-7456230-B2 Cationically photocurable epoxy resin compositions HENKEL CORPORATION (US) 2008-11-25 US disclosed
US-20070208106-A1 Cationically Curable Epoxy Resin Composition Henkel IP & Holding GmbH (DE) 2007-09-06 US disclosed
CN-1288207-C Photocationic curable epoxy resin composition HENKEL LOCTITE CORP (US) 2006-12-06 CN disclosed
US-20050245643-A1 Photo-induced cation curable epoxy resin composition Henkel IP & Holding GmbH (DE) 2005-11-03 US disclosed
CN-1665881-A Photocationic curable epoxy resin composition HENKEL LOCTITE CORP (US) 2005-09-07 CN disclosed