SCHEMBL31179974

SCHEMBL31179974

O=C1C=CC(=O)N1c1cc(N2C(=O)C=CC2=O)c(O)cc1O

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ TLR9 Q9NR96 3/20 0.48
▸ MGLL Q99685 12/20 0.43
▸ HSP90AA1 P07900 5/20 0.43
▸ PKM P14618 4/20 0.43
▸ NPSR1 Q6W5P4 4/20 0.43
▸ TDP1 Q9NUW8 3/20 0.43
▸ MAPK1 P28482 2/20 0.43
▸ FAAH O00519 3/20 0.40
▸ G6PD P11413 2/20 0.39
▸ NSD2 O96028 1/20 0.39
▸ KEAP1 Q14145 1/20 0.39
▸ NFE2L2 Q16236 1/20 0.39
▸ CCR6 P51684 4/20 0.38
▸ ALDH1A1 P00352 3/20 0.37
▸ MAPT P10636 2/20 0.37
▸ ATM Q13315 1/20 0.37
▸ RAB9A P51151 1/20 0.37
▸ CACNA1B Q00975 1/20 0.37
▸ APBA1 Q02410 1/20 0.37
▸ APOBEC3G Q9HC16 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11647371 0.74 HSP90AA1 (0.54) TLR9MGLLHSP90AA1PKMNPSR1
SCHEMBL24939676 0.72 MYC (0.56) TLR9HSP90AA1PKMNPSR1TDP1
SCHEMBL10885514 0.72 TLR9 (0.41) TLR9MGLLHSP90AA1PKMNPSR1
SCHEMBL9838894 0.72 HSP90AA1 (0.47) TLR9MGLLHSP90AA1PKMNPSR1
SCHEMBL142504 0.71 TLR9 (0.70) TLR9MGLLHSP90AA1PKMNPSR1
SCHEMBL29366386 0.71 TLR9 (0.70) TLR9MGLLHSP90AA1PKMNPSR1
SCHEMBL21888605 0.71 ESR1 (0.48) TLR9MGLLHSP90AA1PKMNPSR1
SCHEMBL5078134 0.70 MGLL (0.56) TLR9MGLLHSP90AA1PKMNPSR1
SCHEMBL5081392 0.70 MGLL (0.56) TLR9MGLLHSP90AA1PKMNPSR1
SCHEMBL10887850 0.69 TLR9 (0.38) TLR9MGLLHSP90AA1PKMNPSR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118772377-A Urea epoxy curing accelerator, epoxy conductive silver adhesive and preparation method 汉方新材料科技(嘉善)有限公司 2024-10-15 — — CN disclosed
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