Acrylic Acid

Acrylic Acid

SCHEMBL3125073

C=CC(=O)O.N#CO

nearest known ligand 0.00

Full drug profile on Sugi Atlas →

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Acrylic Acid SCHEMBL31460918 1.00 LMNA (0.67)
Acrylic Acid SCHEMBL29940046 0.90 LMNA (0.71)
Acrylic Acid SCHEMBL27691903 0.90 LMNA (0.71)
Acrylic Acid SCHEMBL27346860 0.90
Acrylic Acid SCHEMBL233722 0.86
Acrylic Acid SCHEMBL3625552 0.86 LMNA (0.91)
Acrylic Acid SCHEMBL6048303 0.86
Acrylic Acid SCHEMBL21612747 0.86 LMNA (0.91)
Acrylic Acid SCHEMBL9694843 0.86
Acrylic Acid SCHEMBL28796751 0.86 LMNA (0.91)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230246214-A1 METHOD FOR PRODUCTION OF AN AT LEAST TWO-LAYERED LAMINATE OF A MEMBRANE ELECTRODE ASSEMBLY AUDI AG (DE) 2023-08-03 US disclosed
US-11518604-B2 Systems, methods and devices for aerosol spraying of silicone based topical skin adhesives for sealing wounds ETHICON, INC. (US) 2022-12-06 US disclosed
WO-2021240363-A1 SYSTEMS, METHODS AND DEVICES FOR AEROSOL SPRAYING OF SILICONE BASED TOPICAL SKIN ADHESIVES FOR SEALING WOUNDS ETHICON, INC. (US) 2021-12-02 WO disclosed
US-20210371190-A1 SYSTEMS, METHODS AND DEVICES FOR AEROSOL SPRAYING OF SILICONE BASED TOPICAL SKIN ADHESIVES FOR SEALING WOUNDS ETHICON, INC. 2021-12-02 US disclosed
CN-108003802-A Thermal self-healing ultraviolet curing adhesive based on gradual polymerization mechanism 烟台德邦科技有限公司 2018-05-08 CN disclosed
CN-107272335-A Photosensitive polymer combination 东京应化工业株式会社 2017-10-20 CN disclosed
WO-2010055282-A1 COMPOSITE SENSOR QINETIQ LIMITED (GB) 2010-05-20 WO disclosed
US-7060737-B2 Curable composition, cured product thereof, and laminated material DSM IP ASSETS B.V. (NL) 2006-06-13 US disclosed
EP-1373415-B1 CURABLE COMPOSITION, CURED PRODUCT THEREOF, AND LAMINATED MATERIAL KONINK DSM N V (NL) 2005-07-20 EP disclosed
US-20040157972-A1 Curable composition, cured product thereof, and laminated material JSR CORPORATION (JP) 2004-08-12 US disclosed
EP-1373415-A2 CURABLE COMPOSITION, CURED PRODUCT THEREOF, AND LAMINATED MATERIAL DSM N.V. (NL) 2004-01-02 EP disclosed
WO-2002079328-A2 CURABLE COMPOSITION, CURED PRODUCT THEREOF, AND LAMINATED MATERIAL DSM IP ASSETS B.V. (NL) 2002-10-10 WO disclosed
US-4497851-A Method for the fabrication of transferable enamel sheet NORDIPA AG (CH) 1985-02-05 US disclosed
US-4451522-A Transferable enamel sheet and method and apparatus for its fabrication NORDIPA AG (CH) 1984-05-29 US disclosed