SCHEMBL3130463

SCHEMBL3130463

CCN(CC)c1ccc2nc3ccc(N)cc3[n+](-c3ccccc3)c2c1

nearest known ligand 1.00 ✓ in ChEMBL — recovers established targets

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
L3MBTL1 Q9Y468 3/20 1.00
NPC1 O15118 3/20 1.00
RAB9A P51151 2/20 1.00
NLRP3 Q96P20 2/20 1.00
MEN1 O00255 3/20 0.54
KMT2A Q03164 3/20 0.54
POLB P06746 2/20 0.54
USP2 O75604 1/20 0.54
BLM P54132 1/20 0.54
TERT O14746 1/20 0.44
ALDH1A1 P00352 4/20 0.41
MAPK1 P28482 2/20 0.41
TSHR P16473 2/20 0.41
TDP1 Q9NUW8 2/20 0.41
PSMD14 O00487 1/20 0.41
CYP3A4 P08684 1/20 0.41
RECQL P46063 1/20 0.41
GFER P55789 1/20 0.41
MAPT P10636 6/20 0.40
KDM4E B2RXH2 4/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrochloric Acid SCHEMBL930666 1.00 L3MBTL1 (1.00) L3MBTL1NPC1RAB9ANLRP3MEN1
Hydrochloric Acid SCHEMBL29536468 0.92 NPC1 (0.85) L3MBTL1NPC1RAB9ANLRP3MEN1
SCHEMBL19970699 0.92 NPC1 (0.85) L3MBTL1NPC1RAB9ANLRP3MEN1
Hydrochloric Acid SCHEMBL28418789 0.88 NPC1 (0.79) L3MBTL1NPC1RAB9ANLRP3MEN1
SCHEMBL21339493 0.87 RAB9A (0.77) L3MBTL1NPC1RAB9ANLRP3MEN1
SCHEMBL25937567 0.87 L3MBTL1 (0.77) L3MBTL1NPC1RAB9ANLRP3MEN1
Hydrochloric Acid SCHEMBL865599 0.85 NPC1 (0.74) L3MBTL1NPC1RAB9ANLRP3MEN1
SCHEMBL19970692 0.85 NPC1 (0.74) L3MBTL1NPC1RAB9ANLRP3MEN1
Hydrochloric Acid SCHEMBL6257184 0.85 NPC1 (0.74) L3MBTL1NPC1RAB9ANLRP3MEN1
Hydrochloric Acid SCHEMBL4858940 0.85 RAB9A (0.74) L3MBTL1NPC1RAB9ANLRP3MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 56 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024006477-A1 MULTIPLEX DYE COMPOUNDS Life Technologies Corporation (US) 2024-01-04 WO disclosed
WO-2024006927-A1 COMPOSITIONS, KITS, AND METHODS FOR DETECTING NUCLEIC ACIDS USING INTRA-CHANNEL MULTIPLEXING Life Technologies Corporation (US) 2024-01-04 WO disclosed
EP-4043961-B1 2K SYSTEM XETOS AG (DE) 2023-08-16 EP disclosed
US-10982343-B2 Plating compositions for electrolytic copper deposition, its use and a method for electrolytically depositing a copper or copper alloy layer onto at least one surface of a substrate ATOTECH DEUTSCHLAND GMBH (DE) 2021-04-20 US disclosed
US-20200347504-A1 PLATING COMPOSITIONS FOR ELECTROLYTIC COPPER DEPOSITION, ITS USE AND A METHOD FOR ELECTROLYTICALLY DEPOSITING A COPPER OR COPPER ALLOY LAYER ONTO AT LEAST ONE SURFACE OF A SUBSTRATE ATOTECH DEUTSCHLAND GMBH (DE) 2020-11-05 US disclosed
US-10695830-B2 Copper powder, copper paste using same, conductive coating material, conductive sheet, and method for producing copper powder SUMITOMO METAL MINING CO., LTD. (JP) 2020-06-30 US disclosed
EP-3660171-A1 NUCLEIC ACID COMPLEX PAIR, COMPETITIVE STRUCTURE, AND PCR KIT USING BOTH Nbiotech Co., Ltd. (KR) 2020-06-03 EP disclosed
US-10654101-B2 Silver-coated copper powder, copper paste using same, conductive coating material, conductive sheet, and method for producing silver-coated copper powder SUMITOMO METAL MINING CO., LTD. (JP) 2020-05-19 US disclosed
US-10619178-B2 Biosensor and production method for same ARKRAY, INC. (JP) 2020-04-14 US disclosed
EP-3483307-B1 PLATING COMPOSITIONS FOR ELECTROLYTIC COPPER DEPOSITION, ITS USE AND A METHOD FOR ELECTROLYTICALLY DEPOSITING A COPPER OR COPPER ALLOY LAYER ONTO AT LEAST ONE SURFACE OF A SUBSTRATE ATOTECH DEUTSCHLAND GMBH (DE) 2020-04-01 EP disclosed
US-6777243-B2 MEASURING DETECTABLE SUBSTANCE BY USING AQUEOUS REACTION SYSTEM INCLUDING FORMATION REACTION OF DETECTABLE SUBSTANCE BASED ON CHEMICAL REACTION OF ANALYTE CONTAINED IN SAMPLE; REACTING IN PRESENCE OF LAYERED INORGANIC COMPOUND ARKRAY INC. (JP) 2004-08-17 US disclosed
US-20030203503-A1 Method for measuring substance and testing piece FUKUOKA TAKAO (JP) 2003-10-30 US disclosed
US-20030180183-A1 Method for measuring substance and testing piece FUKUOKA TAKAO (JP) 2003-09-25 US disclosed
US-20030175985-A1 Method for measuring substance and testing piece FUKUOKA TAKAO (JP) 2003-09-18 US disclosed
US-20030175984-A1 Method for measuring substance and testing piece FUKUOKA TAKAO (JP) 2003-09-18 US disclosed
US-20030166295-A1 Method for measuring substance and testing piece FUKUOKA TAKAO (JP) 2003-09-04 US disclosed
US-20030044316-A1 Specimen having capability of separating solid component ARKRAY INC. (JP) 2003-03-06 US disclosed
EP-1271143-A1 SPECIMEN HAVING CAPABILITY OF SEPARATING SOLID COMPONENT ARKRAY, Inc. (JP) 2003-01-02 EP disclosed
EP-0860695-A9 METHOD OF MEASUREMENT OF MATERIAL AND TESTPIECE KABUSHIKI KAISHA KYOTO DAIICHI KAGAKU (JP) 2001-10-17 EP disclosed
EP-0860695-A1 METHOD OF MEASUREMENT OF MATERIAL AND TESTPIECE KABUSHIKI KAISHA KYOTO DAIICHI KAGAKU (JP) 1998-08-26 EP disclosed