SCHEMBL31361780

SCHEMBL31361780

Cc1cc(N2C(=O)c3ccccc3C2=O)c(O)c(-n2nc3ccccc3n2)c1C

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NPC1 O15118 3/20 0.40
RAB9A P51151 3/20 0.40
LMNA P02545 1/20 0.40
POLB P06746 1/20 0.39
ESR1 P03372 1/20 0.39
ESR2 Q92731 1/20 0.39
MEN1 O00255 3/20 0.38
KMT2A Q03164 3/20 0.38
ANPEP P15144 1/20 0.38
DPP4 P27487 1/20 0.38
NR1H2 P55055 1/20 0.38
NR1H3 Q13133 1/20 0.38
TYMS P04818 1/20 0.37
GRM1 Q13255 3/20 0.37
HSD17B10 Q99714 1/20 0.35
ALDH1A1 P00352 1/20 0.34
SMN1; SMN2 Q16637 1/20 0.34
GRM4 Q14833 1/20 0.34
KDM4E B2RXH2 1/20 0.34
CYP1A2 P05177 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31361783 0.85 NPC1 (0.37) NPC1RAB9ALMNAPOLBESR1
SCHEMBL31361784 0.82 NPC1 (0.34) NPC1RAB9ALMNAPOLBESR1
SCHEMBL14462719 0.71 NPC1 (0.41) NPC1RAB9ALMNAPOLBMEN1
SCHEMBL30915201 0.70 MEN1 (0.41) NPC1RAB9ALMNAPOLBMEN1
SCHEMBL14462706 0.68 NPC1 (0.54) NPC1RAB9ALMNAPOLBMEN1
SCHEMBL14462712 0.68 NPC1 (0.50) NPC1RAB9ALMNAPOLBMEN1
SCHEMBL31361787 0.68 NPC1 (0.40) NPC1RAB9ALMNAPOLBMEN1
SCHEMBL6744460 0.67 DPP4 (0.43) NPC1RAB9ALMNAMEN1KMT2A
SCHEMBL14462715 0.67 NPC1 (0.37) NPC1RAB9ALMNAPOLBKDM4E
SCHEMBL14462703 0.67 NPC1 (0.51) NPC1RAB9ALMNAPOLBMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4520793-A1 RESIN COMPOSITION, MOLDED ARTICLE, AND METHOD FOR PRODUCING RESIN COMPOSITION Mitsubishi Chemical Corporation (JP) 2025-03-12 EP disclosed
US-20250051564-A1 RESIN COMPOSITION, MOLDED ARTICLE, AND METHOD FOR PRODUCING RESIN COMPOSITION MITSUBISHI CHEMICAL CORPORATION (JP) 2025-02-13 US disclosed