SCHEMBL31361787

SCHEMBL31361787

Cc1cc(CCn2nc3ccccc3n2)c(O)c(N2C(=O)c3ccccc3C2=O)c1

nearest known ligand 0.45

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
NPC1 O15118 3/20 0.40
RAB9A P51151 3/20 0.40
NR1H3 Q13133 6/20 0.39
POLB P06746 1/20 0.39
LMNA P02545 1/20 0.36
NR1H2 P55055 2/20 0.36
L3MBTL1 Q9Y468 2/20 0.35
MAPT P10636 1/20 0.35
SMN1; SMN2 Q16637 1/20 0.35
TYMS P04818 1/20 0.34
HPGD P15428 1/20 0.34
GRM5 P41594 1/20 0.34
MEN1 O00255 1/20 0.34
KMT2A Q03164 1/20 0.34
ALDH1A1 P00352 2/20 0.34
TSHR P16473 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31267549 0.81 NPC1 (0.51) NPC1RAB9APOLBLMNAL3MBTL1
SCHEMBL672147 0.81 NPC1 (0.51) NPC1RAB9APOLBLMNAL3MBTL1
SCHEMBL673874 0.76 NPC1 (0.47) NPC1RAB9APOLBLMNAL3MBTL1
SCHEMBL29388780 0.74 NPC1 (0.53) NPC1RAB9APOLBLMNAMAPT
SCHEMBL30772443 0.74 NPC1 (0.53) NPC1RAB9APOLBLMNAMAPT
SCHEMBL674407 0.74 NPC1 (0.53) NPC1RAB9APOLBLMNAMAPT
SCHEMBL10061927 0.72 NPC1 (0.64) NPC1RAB9APOLBLMNAL3MBTL1
SCHEMBL7904369 0.70 NPC1 (0.61) NPC1RAB9APOLBLMNAL3MBTL1
SCHEMBL29520058 0.70 NPC1 (0.61) NPC1RAB9APOLBLMNAL3MBTL1
SCHEMBL31361780 0.68 NPC1 (0.40) NPC1RAB9ANR1H3POLBLMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4520793-A1 RESIN COMPOSITION, MOLDED ARTICLE, AND METHOD FOR PRODUCING RESIN COMPOSITION Mitsubishi Chemical Corporation (JP) 2025-03-12 EP disclosed
US-20250051564-A1 RESIN COMPOSITION, MOLDED ARTICLE, AND METHOD FOR PRODUCING RESIN COMPOSITION MITSUBISHI CHEMICAL CORPORATION (JP) 2025-02-13 US disclosed