SCHEMBL31361784

SCHEMBL31361784

Cc1c(C(C)(C)c2ccccc2)cc(N2C(=O)c3ccccc3C2=O)c(O)c1-n1nc2ccccc2n1

nearest known ligand 0.36

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NPC1 O15118 2/20 0.34
RAB9A P51151 2/20 0.34
LMNA P02545 2/20 0.34
POLB P06746 1/20 0.34
PPARG P37231 1/20 0.33
PPARA Q07869 1/20 0.33
PDCD1 Q15116 4/20 0.32
CD274 Q9NZQ7 4/20 0.32
TYMS P04818 1/20 0.32
NR1H2 P55055 2/20 0.32
NR1H3 Q13133 2/20 0.32
MEN1 O00255 2/20 0.31
KMT2A Q03164 2/20 0.31
USP2 O75604 1/20 0.31
MAPT P10636 1/20 0.31
TNNI3 P19429 1/20 0.31
HTT P42858 1/20 0.31
TNNT2 P45379 1/20 0.31
TNNC1 P63316 1/20 0.31
SMN1; SMN2 Q16637 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31361783 0.89 NPC1 (0.37) NPC1RAB9ALMNAPOLBPPARG
SCHEMBL31361780 0.82 NPC1 (0.40) NPC1RAB9ALMNAPOLBTYMS
SCHEMBL31212619 0.81 NPC1 (0.39) NPC1RAB9ALMNAPOLBPPARG
SCHEMBL26383710 0.74 ESR1 (0.40) NPC1RAB9ALMNAPOLBPPARG
SCHEMBL21245442 0.71 ESR1 (0.40) NPC1RAB9ALMNAPOLBPPARG
SCHEMBL7939741 0.71 ANPEP (0.38) LMNATYMSNR1H3ANPEPDPP4
SCHEMBL3263879 0.70 NPC1 (0.51) NPC1RAB9ALMNAPOLBPPARG
SCHEMBL8861272 0.69 NPC1 (0.58) NPC1RAB9ALMNAPOLBPPARG
SCHEMBL21300037 0.69 NPC1 (0.40) NPC1RAB9ALMNAPOLBPPARG
SCHEMBL7939737 0.69 GAA (0.38) NPC1RAB9APOLBMEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4520793-A1 RESIN COMPOSITION, MOLDED ARTICLE, AND METHOD FOR PRODUCING RESIN COMPOSITION Mitsubishi Chemical Corporation (JP) 2025-03-12 EP disclosed
US-20250051564-A1 RESIN COMPOSITION, MOLDED ARTICLE, AND METHOD FOR PRODUCING RESIN COMPOSITION MITSUBISHI CHEMICAL CORPORATION (JP) 2025-02-13 US disclosed