SCHEMBL31361783

SCHEMBL31361783

Cc1c(C(C)(C)C)cc(N2C(=O)c3ccccc3C2=O)c(O)c1-n1nc2ccccc2n1

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NPC1 O15118 3/20 0.37
RAB9A P51151 3/20 0.37
LMNA P02545 1/20 0.36
POLB P06746 1/20 0.36
NR1H3 Q13133 4/20 0.34
NR1H2 P55055 2/20 0.34
PPARG P37231 1/20 0.33
PPARA Q07869 1/20 0.33
ESR1 P03372 1/20 0.33
ESR2 Q92731 1/20 0.33
MEN1 O00255 2/20 0.33
KMT2A Q03164 2/20 0.33
HSD17B10 Q99714 1/20 0.33
PTPN1 P18031 1/20 0.33
ANPEP P15144 1/20 0.33
DPP4 P27487 1/20 0.33
TYMS P04818 1/20 0.32
SMN1; SMN2 Q16637 2/20 0.32
GAA P10253 1/20 0.32
MAPT P10636 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31361784 0.89 NPC1 (0.34) NPC1RAB9ALMNAPOLBNR1H3
SCHEMBL31361780 0.85 NPC1 (0.40) NPC1RAB9ALMNAPOLBNR1H3
SCHEMBL14462709 0.80 NPC1 (0.42) NPC1RAB9ALMNAPOLBPPARG
SCHEMBL14462719 0.73 NPC1 (0.41) NPC1RAB9ALMNAPOLBPPARG
SCHEMBL2045035 0.72 NPC1 (0.50) NPC1RAB9ALMNAPOLBPPARG
SCHEMBL7077655 0.71 CA2 (0.44) NPC1RAB9ALMNAPOLBPPARG
SCHEMBL29192819 0.70 NPC1 (0.43) NPC1RAB9ALMNAPOLBPPARG
SCHEMBL31212619 0.68 NPC1 (0.39) NPC1RAB9ALMNAPOLBPPARG
SCHEMBL29229951 0.68 NPC1 (0.39) NPC1RAB9ALMNAPOLBPPARG
SCHEMBL30917286 0.68 NPC1 (0.39) NPC1RAB9ALMNAPOLBPPARG

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4520793-A1 RESIN COMPOSITION, MOLDED ARTICLE, AND METHOD FOR PRODUCING RESIN COMPOSITION Mitsubishi Chemical Corporation (JP) 2025-03-12 EP disclosed
US-20250051564-A1 RESIN COMPOSITION, MOLDED ARTICLE, AND METHOD FOR PRODUCING RESIN COMPOSITION MITSUBISHI CHEMICAL CORPORATION (JP) 2025-02-13 US disclosed