SCHEMBL31367741

SCHEMBL31367741

CCCCCCCCCCCCCCCCCCCCCC=CC(=O)OCC1CO1

nearest known ligand 0.68

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
ENPP2 Q13822 5/20 0.47
LPAR2 Q9HBW0 2/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6873723 1.00 ENPP2 (0.47) ENPP2LPAR2
SCHEMBL9770173 1.00 ENPP2 (0.47) ENPP2LPAR2
SCHEMBL31367745 1.00 ENPP2 (0.47) ENPP2LPAR2
SCHEMBL9770176 1.00 ENPP2 (0.47) ENPP2LPAR2
SCHEMBL11653793 0.94 MAPT (0.45) ENPP2
SCHEMBL25348870 0.88 MGLL (0.46)
SCHEMBL29006366 0.88 MGLL (0.46)
SCHEMBL29185444 0.86 PTPN1 (0.42) ENPP2LPAR2
SCHEMBL28617129 0.83 ALDH1A1 (0.50) ENPP2LPAR2
SCHEMBL27850338 0.83 TSHR (0.45) ENPP2LPAR2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024262261-A1 EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF 株式会社スリーボンド 2024-12-26 WO disclosed